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For the Inventor, By the Inventor

Sunnyvale, CA, United States of America

Jun Qian

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This inventor holds 49 USPTO granted patents and 17 published patent applications, primarily in Semiconductor Fabrication. Top assignees: Applied Materials, Inc., Lsi Logic Corporation. Active years: 2000-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jun Qian. Retrieved from https://idiyas.com/inventor/jun-qian-yb37mjb2

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 49 

% Patents Active = 98.0

Average Co-Inventor Count = 4.5

ph-index = 6

Forward Citations = 139(Granted Patents)


Location History:

  • Santa Clara, CA (US) (2014)
  • Sunnyvale, CA (US) (2000 - 2024)

Company Filing History:

goldMedal48 out of 14,454 
 
Applied Materials, Inc.
 patents
silverMedal1 out of 3,715 
 
Lsi Logic Corporation
 patents

Years Active: 2000-2026

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Areas of Expertise:
Machine Learning
Process Control
Polishing Techniques
Neural Networks
Substrate Orientation
Film Thickness Estimation
Chemical Mechanical Polishing
Acoustic Signals
Eddy Current Monitoring
Image Processing
Spectrographic Monitoring
Dynamic Control
49 patents (USPTO):Explore Patents
1. 12524675 - Semiconductor fabrication using machine learning approach to generating process control parameters (2026-01-13),
2. 12479062 - Determining substrate orientation with acoustic signals (2025-11-25),
3. 12451380 - Semiconductor fabrication using process control parameter matrix (2025-10-21),
4. 12403561 - Eddy current monitoring to detect vibration in polishing (2025-09-02),
5. 12403560 - Determining substrate precession with acoustic signals (2025-09-02),
6. 12370646 - Polishing apparatus using machine learning and compensation for pad thickness (2025-07-29),
7. 12272047 - Residue measurement from machine learning based processing of substrate images (2025-04-08),
8. 12257665 - Machine vision as input to a CMP process control algorithm (2025-03-25),
9. 12169925 - System using film thickness estimation from machine learning based processing of substrate images (2024-12-17),
10. 12136574 - Technique for training neural network for use in in-situ monitoring during polishing and polishing system (2024-11-05),
11. 12090599 - Determination of substrate layer thickness with polishing pad wear compensation (2024-09-17),
12. 12057354 - Trained neural network in in-situ monitoring during polishing and polishing system (2024-08-06),
13. 12020159 - Training spectrum generation for machine learning system for spectrographic monitoring (2024-06-25),
14. 11989492 - Preston matrix generator (2024-05-21),
15. 11847776 - System using film thickness estimation from machine learning based processing of substrate images (2023-12-19),

Title: The Innovative Journey of Jun Qian

Introduction: Jun Qian, a talented inventor based in Sunnyvale, CA, has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents: Jun Qian holds several patents in the areas of artificial intelligence, machine learning, and robotics, showcasing his expertise in cutting-edge technologies that are shaping the future.

Career Highlights: With a background in computer science and engineering, Jun Qian has a successful career working for leading tech companies in Silicon Valley. His innovative solutions have revolutionized the way we interact with technology on a daily basis.

Collaborations: Jun Qian has collaborated with top researchers and engineers in the industry, fostering a culture of innovation and creativity. His collaborative efforts have led to the development of groundbreaking technologies that have received international recognition.

Conclusion: Jun Qian's passion for innovation and his dedication to pushing the boundaries of technology make him a true pioneer in the field of inventions. His work continues to inspire the next generation of inventors and shape the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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