The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2024

Filed:

Aug. 28, 2019
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Sivakumar Dhandapani, San Jose, CA (US);

Thomas Li, Santa Clara, CA (US);

Jun Qian, Sunnyvale, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 49/10 (2006.01); B24B 37/04 (2012.01); G06F 30/17 (2020.01); G06F 30/333 (2020.01); G06F 115/10 (2020.01);
U.S. Cl.
CPC ...
G06F 30/17 (2020.01); B24B 37/042 (2013.01); B24B 49/10 (2013.01); G06F 30/333 (2020.01); G06F 2115/10 (2020.01);
Abstract

A method of generating a matrix to relate a plurality of controllable parameters of a chemical mechanical polishing system to a polishing rate profile includes polishing a test substrate. The test substrate is polished for a first period of time using baseline parameter values with a first parameter set to a first value, and the test substrate is polished for a second period of time using first modified parameter values with the first parameter set to a modified second value. A thickness of the test substrate is monitored during polishing, and a baseline polishing rate profile is determined for the first period of time and a first modified polishing rate profile is determined for the second period of time. The matrix is calculated based on the baseline parameter values, the first modified parameters, the baseline polishing rate profile and the first modified polishing rate profile.


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