The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 25, 2025

Filed:

Feb. 02, 2023
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Benjamin Cherian, San Jose, CA (US);

Jun Qian, Sunnyvale, CA (US);

Nicholas A. Wiswell, Sunnyvale, CA (US);

Dominic J. Benvegnu, La Honda, CA (US);

Boguslaw A. Swedek, Morgan Hill, CA (US);

Thomas H. Osterheld, Mountain View, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 37/013 (2012.01); G06N 3/084 (2023.01);
U.S. Cl.
CPC ...
B24B 37/013 (2013.01); G06N 3/084 (2013.01);
Abstract

During chemical mechanical polishing of a substrate, a signal value that depends on a thickness of a layer in a measurement spot on a substrate undergoing polishing is determined by a first in-situ monitoring system. An image of at least the measurement spot of the substrate is generated by a second in-situ imaging system. Machine vision processing, e.g., a convolutional neural network, is used to determine a characterizing value for the measurement spot based on the image. Then a measurement value is calculated based on both the characterizing value and the signal value.


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