The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 18, 2018

Filed:

Jul. 17, 2014
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Hung Chih Chen, Sunnyvale, CA (US);

Paul D. Butterfield, San Jose, CA (US);

Jay Gurusamy, Santa Clara, CA (US);

Jason Garcheung Fung, Santa Clara, CA (US);

Shou-Sung Chang, Mountain View, CA (US);

Jimin Zhang, San Jose, CA (US);

Eric Lau, Santa Clara, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/26 (2012.01); B24B 37/10 (2012.01); B24B 37/22 (2012.01);
U.S. Cl.
CPC ...
B24B 37/10 (2013.01);
Abstract

A chemical mechanical polishing apparatus includes a plate on which a substrate is received, and a movable polishing pad support and coupled polishing pad which move across the substrate and orbit a local region of the substrate during polishing operation. The load of the pad against the substrate, the revolution rate of the pad, and the size, shape, and composition of the pad, may be varied to control the rate of material removed by the pad.


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