The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2020

Filed:

Aug. 30, 2017
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Paul D. Butterfield, San Jose, CA (US);

Thomas H. Osterheld, Mountain View, CA (US);

Jeonghoon Oh, Saratoga, CA (US);

Shou-Sung Chang, Mountain View, CA (US);

Steven M. Zuniga, Soquel, CA (US);

Fred C. Redeker, Fremont, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/20 (2012.01); B24B 37/005 (2012.01); B24B 37/013 (2012.01); B24B 49/12 (2006.01); B24B 41/02 (2006.01); B24B 53/02 (2012.01);
U.S. Cl.
CPC ...
B24B 37/005 (2013.01); B24B 37/013 (2013.01); B24B 37/20 (2013.01); B24B 37/205 (2013.01); B24B 41/02 (2013.01); B24B 49/12 (2013.01); B24B 53/02 (2013.01);
Abstract

A polishing system includes a platen having a top surface, an annular polishing pad supported on the platen, a carrier head to hold a substrate in contact with the annular polishing pad, a support structure from which the carrier head is suspended and which is configured to move the hold the carrier head laterally across the polishing pad, and a controller. The platen is rotatable about an axis of rotation that passes through approximately the center of the platen, and the inner edge of the annular polishing pad is positioned around the axis of rotation. The controller is configured to cause the support structure to position the carrier head such that a portion of the substrate overhangs the inner edge of the annular polishing pad while the substrate is contacting the polishing pad.


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