Location History:
- Campbell, CA (US) (2002 - 2003)
- San Jose, CA (US) (2004 - 2024)
Company Filing History:
Years Active: 2002-2024
Title: Innovations of Ming-Kuei Tseng
Introduction
Ming-Kuei Tseng is a prominent inventor based in San Jose, California, known for her significant contributions to the field of vacuum technology. With a total of 13 patents to her name, she has made remarkable advancements that enhance the efficiency and functionality of processing chambers used in various industrial applications.
Latest Patents
One of her latest patents focuses on vacuum pump protection against deposition byproduct buildup. This innovation addresses the challenges faced in processing chambers, such as plasma etch chambers, where byproducts from deposition and etch operations can accumulate in the vacuum pump system. The patent describes a vacuum pump system that may include multiple roughing pumps, allowing for the diversion of etch gases and deposition precursors to separate pumps. Additionally, the design incorporates gas ejectors or venturi pumps at the outlet of a primary pump to prevent the formation of deposition byproducts. The system also facilitates cleaning operations, including waferless automated cleaning, using specific clean chemistries to remove byproducts effectively.
Career Highlights
Ming-Kuei Tseng has had a distinguished career, working with leading companies in the semiconductor industry. She has been associated with Applied Materials, Inc. and Lam Research Corporation, where she has contributed her expertise in vacuum technology and processing systems.
Collaborations
Throughout her career, Ming-Kuei has collaborated with notable professionals in her field, including Steven M. Zuniga and Dan A. Marohl. These collaborations have further enriched her work and led to innovative solutions in vacuum technology.
Conclusion
Ming-Kuei Tseng's contributions to vacuum technology and her innovative patents have significantly impacted the semiconductor industry. Her work continues to inspire advancements in processing chamber efficiency and functionality.