The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 2007
Filed:
Jan. 08, 2005
Yongqi HU, Campbell, CA (US);
Yan Wang, Sunnyvale, CA (US);
Alain Duboust, Sunnyvale, CA (US);
Feng Q. Liu, San Jose, CA (US);
Antoine P. Manens, Palo Alto, CA (US);
Siew S. Neo, Santa Clara, CA (US);
Stan D. Tsai, Fremont, CA (US);
Liang-yuh Chen, Foster City, CA (US);
Paul D. Butterfield, San Jose, CA (US);
Yuan A. Tian, San Jose, CA (US);
Sen-hou Ko, Sunnyvale, CA (US);
Yongqi Hu, Campbell, CA (US);
Yan Wang, Sunnyvale, CA (US);
Alain Duboust, Sunnyvale, CA (US);
Feng Q. Liu, San Jose, CA (US);
Antoine P. Manens, Palo Alto, CA (US);
Siew S. Neo, Santa Clara, CA (US);
Stan D. Tsai, Fremont, CA (US);
Liang-Yuh Chen, Foster City, CA (US);
Paul D. Butterfield, San Jose, CA (US);
Yuan A. Tian, San Jose, CA (US);
Sen-Hou Ko, Sunnyvale, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
Embodiments of a polishing article for processing a substrate are provided. In one embodiment, a polishing article for processing a substrate comprises a fabric layer having a conductive layer disposed thereover. The conductive layer has an exposed surface adapted to polish a substrate. The fabric layer may be woven or non-woven. The conductive layer may be comprised of a soft metal and, in one embodiment, the exposed surface may be planar.