The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2011
Filed:
Jan. 26, 2005
Alain Duboust, Sunnyvale, CA (US);
Shou-sung Chang, Los Altos, CA (US);
Wei LU, Fremont, CA (US);
Siew Neo, Santa Clara, CA (US);
Yan Wang, Sunnyvale, CA (US);
Antoine P. Manens, Mountain View, CA (US);
Yongsik Moon, Sunnyvale, CA (US);
Alain Duboust, Sunnyvale, CA (US);
Shou-Sung Chang, Los Altos, CA (US);
Wei Lu, Fremont, CA (US);
Siew Neo, Santa Clara, CA (US);
Yan Wang, Sunnyvale, CA (US);
Antoine P. Manens, Mountain View, CA (US);
Yongsik Moon, Sunnyvale, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
A polishing pad has a polishing layer and a backing layer secured to the polishing layer. The polishing layer has a polishing surface, a first thickness, a first compressibility, and a hardness between about 40 to 80 Shore D. The backing layer has a second thickness and has a second compressibility greater than the first compressibility. The first thickness, first compressibility, second thickness and second compressibility are such that the polishing surface deflects more than the thickness non-uniformity of the polishing layer under an applied pressure of 1.5 psi or less.