The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 2006
Filed:
Feb. 26, 2003
Feng Q. Liu, San Jose, CA (US);
Stan D. Tsai, Fremont, CA (US);
Yongqi HU, Campbell, CA (US);
Siew S. Neo, Santa Clara, CA (US);
Yan Wang, Sunnyvale, CA (US);
Alain Duboust, Sunnyvale, CA (US);
Liang-yuh Chen, Foster City, CA (US);
Feng Q. Liu, San Jose, CA (US);
Stan D. Tsai, Fremont, CA (US);
Yongqi Hu, Campbell, CA (US);
Siew S. Neo, Santa Clara, CA (US);
Yan Wang, Sunnyvale, CA (US);
Alain Duboust, Sunnyvale, CA (US);
Liang-Yuh Chen, Foster City, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a composition includes an acid based electrolyte system, one or more chelating agents, one or more corrosion inhibitors, one or more inorganic or organic acid salts, one or more pH adjusting agents to provide a pH between about 3 and about 10, a polishing enhancing material selected from the group of abrasive particles, one or more oxidizers, and combinations thereof, and a solvent. The composition may be used in an conductive material removal process including disposing a substrate having a conductive material layer formed thereon in a process apparatus comprising an electrode, providing the composition between the electrode and substrate, applying a bias between the electrode and the substrate, and removing conductive material from the conductive material layer.