The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 09, 2007
Filed:
Aug. 30, 2005
Paul D. Butterfield, San Jose, CA (US);
Liang-yuh Chen, Foster City, CA (US);
Yonqi HU, San Jose, CA (US);
Antoine P. Manens, Palo Alto, CA (US);
Rashid Mavliev, Campbell, CA (US);
Stan D. Tsai, Fremont, CA (US);
Feng Q. Liu, San Jose, CA (US);
Ralph Wadensweiler, Sunnyvale, CA (US);
Lizhong Sun, Sunnyvale, CA (US);
Siew S. Neo, Santa Clara, CA (US);
Alain Duboust, Sunnyvale, CA (US);
Paul D. Butterfield, San Jose, CA (US);
Liang-Yuh Chen, Foster City, CA (US);
Yonqi Hu, San Jose, CA (US);
Antoine P. Manens, Palo Alto, CA (US);
Rashid Mavliev, Campbell, CA (US);
Stan D. Tsai, Fremont, CA (US);
Feng Q. Liu, San Jose, CA (US);
Ralph Wadensweiler, Sunnyvale, CA (US);
Lizhong Sun, Sunnyvale, CA (US);
Siew S. Neo, Santa Clara, CA (US);
Alain Duboust, Sunnyvale, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
Embodiments of a polishing article for polishing a substrate are provided. In one embodiment, the polishing article includes a ring-shaped upper layer having a polishing surface, and a conductive layer coupled to the upper layer and forming a replaceable assembly therewith.