The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2008
Filed:
Oct. 08, 2007
Paul D. Butterfield, San Jose, CA (US);
Liang-yuh Chen, Foster City, CA (US);
Yonqi HU, San Jose, CA (US);
Antoine P. Manens, Palo Alto, CA (US);
Rashid Mavliev, Campbell, NC (US);
Stan D. Tsai, Fremont, CA (US);
Feng Q. Liu, San Jose, CA (US);
Ralph Wadensweiler, Sunnyvale, CA (US);
Lizhong Sun, Sunnyvale, CA (US);
Siew S. Neo, Santa Clara, CA (US);
Alain Duboust, Sunnyvale, CA (US);
Paul D. Butterfield, San Jose, CA (US);
Liang-Yuh Chen, Foster City, CA (US);
Yonqi Hu, San Jose, CA (US);
Antoine P. Manens, Palo Alto, CA (US);
Rashid Mavliev, Campbell, NC (US);
Stan D. Tsai, Fremont, CA (US);
Feng Q. Liu, San Jose, CA (US);
Ralph Wadensweiler, Sunnyvale, CA (US);
Lizhong Sun, Sunnyvale, CA (US);
Siew S. Neo, Santa Clara, CA (US);
Alain Duboust, Sunnyvale, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
Embodiments of a polishing article for polishing a substrate are provided. In one embodiment, the polishing article includes an annular upper layer made of a dielectric material coupled to an annular lower layer made of a conductive material, and an annular subpad sandwiched between the annular upper layer and the annular lower layer forming a replaceable assembly therewith.