The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2007
Filed:
Jun. 06, 2003
Yan Wang, Sunnyvale, CA (US);
Feng Q. Liu, San Jose, CA (US);
Alain Duboust, Sunnyvale, CA (US);
Siew S. Neo, Santa Clara, CA (US);
Liang-yuh Chen, Foster City, CA (US);
Yongqi HU, Campbell, CA (US);
Yan Wang, Sunnyvale, CA (US);
Feng Q. Liu, San Jose, CA (US);
Alain Duboust, Sunnyvale, CA (US);
Siew S. Neo, Santa Clara, CA (US);
Liang-Yuh Chen, Foster City, CA (US);
Yongqi Hu, Campbell, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
An apparatus and method for planarizing a surface of a substrate using a chamber separated into two parts by a membrane, and two separate electrolytes is provided. The embodiments of the present invention generally provide an electrochemical mechanical polishing system that reduces the number of defects found on the substrate surface after polishing. An exemplary electrochemical apparatus includes a physical barrier that prevents any trapped gas or gas generated during processing from residing in areas that can cause defects on the substrate. The process can be aided by the addition of various chemical components to the electrolyte that tend to reduce the gas generation at the cathode surface during the ECMP anodic dissolution process.