Osaka, Japan

Shingo Komatsu

This inventor holds 27 USPTO granted patents, primarily in Semiconductor Manufacturing. Top assignees: Matsushita Electric Industrial Co., Ltd., Panasonic Corporation, Dai-Ichi Kogyo Seiyaku Co., Ltd.. Active years: 2002-2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shingo Komatsu. Retrieved from https://idiyas.com/inventor/shingo-komatsu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 63.0

Average Co-Inventor Count = 5.1

ph-index = 11

Forward Citations = 731(Granted Patents)


Location History:

  • Katano, JP (2007)
  • Kadoma, JP (2004 - 2011)
  • Osaka, JP (2002 - 2014)

Company Filing History:


Years Active: 2002-2014

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Areas of Expertise:
Field-Effect Transistor
Flip-Chip Mounting
Flexible Substrate
Semiconductor Device
Solder Bump
Component Built-In Module
Wiring Substrate
Insulation Sheet
Transfer Material
Electronic Component
Manufacturing Process
Bump Forming Resin
27 patents (USPTO):Explore Patents

Title: Shingo Komatsu: Innovator in Semiconductor Technology

Introduction

Shingo Komatsu, located in Osaka, Japan, is a distinguished inventor with an impressive portfolio of 27 patents to his name. His contributions to the field of semiconductor technology have paved the way for advancements in electronic devices, enhancing both performance and manufacturing processes.

Latest Patents

Among his latest patents, Shingo Komatsu has developed a groundbreaking method for manufacturing a field-effect transistor. This invention simplifies the formation of a metal oxide film for thin film transistors, utilizing a metal salt-containing composition along with a specific molar ratio of polyvalent carboxylic acid. His innovative approach significantly enhances manufacturing efficiency.

Another notable patent pertains to a flip-chip mounting resin composition and bump forming resin composition. This invention improves productivity and reliability in flip-chip mounting processes, essential for next-generation large-scale integration (LSI) circuits. The resin composition facilitates an effective electrical connection between circuit substrates and semiconductor chips through a unique heating process that allows metal particles to self-assemble.

Career Highlights

Shingo Komatsu has made significant contributions throughout his career, notably at Matsushita Electric Industrial Co., Ltd. and Panasonic Corporation. His experience in these leading companies in the electronics industry has equipped him with the expertise to drive innovation in semiconductor technologies.

Collaborations

Throughout his career, Shingo has worked alongside notable colleagues such as Seiichi Nakatani and Yasuhiro Sugaya. These collaborations have fostered an environment of innovation and creativity, contributing to the successful development of several innovative technologies in the semiconductor industry.

Conclusion

Shingo Komatsu's achievements reflect his dedication to advancing semiconductor technology and improving manufacturing processes. With 27 patents to his name and ongoing contributions, he exemplifies the spirit of innovation that drives the electronic industry forward. His work continues to influence how electronic devices are designed and manufactured, ensuring efficiency and reliability for future technologies.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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