The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2008
Filed:
Aug. 01, 2006
Yasuhiro Sugaya, Toyonaka, JP;
Toshiyuki Asahi, Osaka, JP;
Shingo Komatsu, Kadoma, JP;
Yoshiyuki Yamamoto, Neyagawa, JP;
Seiichi Nakatani, Hirakata, JP;
Yasuhiro Sugaya, Toyonaka, JP;
Toshiyuki Asahi, Osaka, JP;
Shingo Komatsu, Kadoma, JP;
Yoshiyuki Yamamoto, Neyagawa, JP;
Seiichi Nakatani, Hirakata, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A semiconductor device () of the present invention includes a semiconductor element () including electrode parts (), and a wiring substrate () including an insulation layer (), electrode-part-connection electrodes () provided in the insulation layer (), and external electrodes () that is provided in the insulation layer () and that is connected electrically with the electrode-part-connection electrodes (), in which the electrode parts () and the electrode-part-connection electrodes () are connected electrically with each other. The insulation layer () has an elastic modulus measured according to JIS K6911 of not less than 0.1 GP a and not more than 5 GPa, and the electrodes () and the electrode-part-connection electrodes () are connected by metal joint.