Osaka, Japan

Seiichi Nakatani

USPTO Granted Patents = 194 

 

Average Co-Inventor Count = 3.8

ph-index = 29

Forward Citations = 3,141(Granted Patents)

Forward Citations (Not Self Cited) = 2,988(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Kadoma, JA (1977)
  • Neyagawa, JP (1982 - 1989)
  • Kadoma, JP (1980 - 2009)
  • Hirakata, JP (1989 - 2011)
  • Osaka, JP (1991 - 2018)

Company Filing History:


Years Active: 1977-2018

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Areas of Expertise:
Conductive Paste
Semiconductor Devices
Light-Emitting Devices
Electrochemical Detectors
Flexible Semiconductor Devices
Flip-Chip Mounting
Electronic Component Packages
Ceramic Substrates
Transistors
Rfid Technology
Bump Formation
Electronic Paper
194 patents (USPTO):Explore Patents

Title: Seiichi Nakatani: Pioneering Innovator in Conductive Film Technology

Introduction:

Seiichi Nakatani, an esteemed inventor and researcher hailing from Osaka, Japan, has made significant contributions to the field of semiconductor devices and electronic component packages. With an impressive portfolio of 194 patents, Nakatani's innovative work has helped revolutionize the manufacturing processes and functionality of these crucial technological components. This article aims to shed light on Nakatani's recent patents, career highlights, collaborations, and his impact on the industry as a whole.

Latest Patents:

Nakatani's most recent patents reflect his expertise in developing advanced conductive film technology and innovative manufacturing methods for electronic component packages. One notable patent is the "Conductive paste for forming conductive film for semiconductor devices, semiconductor device, and method for producing semiconductor device." This invention involves a specialized conductive paste consisting of a conductive powder, various additives, glass frit, organic binders, and solvents. The conductive paste enables the deposition of conductive films necessary for semiconductor device fabrication.

Another noteworthy patent is the "Electronic component package and method for manufacturing the same." This invention focuses on a method to manufacture electronic component packages by embedding the component itself and subsequently forming metal plating layers. The method ensures secure integration of metal foils and plating layers, thereby enhancing the overall functionality and reliability of the electronic component package.

Career Highlights:

Throughout his career, Nakatani has worked for renowned companies in the semiconductor industry, leaving a lasting impact on their technological advancements. He has contributed significantly to the growth and success of Matsushita Electric Industrial Co., Ltd., currently known as Panasonic Corporation. His expertise and innovative spirit have played a vital role in advancing the company's semiconductor and electronics divisions.

Collaborations:

Collaboration often fosters innovation, and Nakatani's work is no exception. Alongside his personal achievements, Nakatani has successfully collaborated with esteemed colleagues, including Koichi Hirano and Yoshihisa Yamashita. These collaborations have resulted in groundbreaking research and inventions that have further solidified Nakatani's reputation as a leading figure in the field.

Conclusion:

Seiichi Nakatani is a remarkable innovator whose work in conductive film technology and electronic component packaging has made a significant impact on the semiconductor industry. With an extraordinary patent count of 194, Nakatani's dedication and contributions have driven technological advancements, ultimately shaping the manufacturing processes and functionality of modern semiconductor devices. As we look to the future, Nakatani's groundbreaking inventions will continue to serve as a source of inspiration for researchers and inventors worldwide.

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