The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 2016

Filed:

Apr. 24, 2008
Applicants:

Takashi Kitae, Osaka, JP;

Seiichi Nakatani, Osaka, JP;

Seiji Karashima, Osaka, JP;

Inventors:

Takashi Kitae, Osaka, JP;

Seiichi Nakatani, Osaka, JP;

Seiji Karashima, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23P 19/00 (2006.01); H05K 13/04 (2006.01); H05K 3/34 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 29/06 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H05K 3/3436 (2013.01); H01L 21/6835 (2013.01); H01L 24/11 (2013.01); H01L 24/12 (2013.01); H01L 24/16 (2013.01); H05K 3/3484 (2013.01); H01L 24/81 (2013.01); H01L 29/0657 (2013.01); H01L 2224/13099 (2013.01); H01L 2224/16 (2013.01); H01L 2224/293 (2013.01); H01L 2224/8101 (2013.01); H01L 2224/81201 (2013.01); H01L 2224/81801 (2013.01); H01L 2924/0102 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01009 (2013.01); H01L 2924/01011 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01056 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/09701 (2013.01); H01L 2924/10157 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/15788 (2013.01); H05K 3/323 (2013.01); H05K 2201/09036 (2013.01); H05K 2201/10977 (2013.01); H05K 2203/083 (2013.01); H05K 2203/087 (2013.01); Y02P 70/613 (2015.11); Y10T 29/49137 (2015.01); Y10T 29/49144 (2015.01);
Abstract

An electronic component assembly including a first electronic component including a plurality of first electrodes provided on a first major surface of the first electronic component; and a second electronic component including a plurality of second electrodes provided on a first major surface of the second electronic component. A resin including solder powder is provided between the first electronic component and the second electronic component. Also, solder connections are provided to electrically interconnect the first and second electrodes. Elongated grooves are provided in surfaces of the electronic components. The grooves are provided for generation of bubbles during the process for producing the electronic component assembly to promote movement of the solder powder.


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