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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9425122 B1

PDFFull Text
Date of Patent:
Aug. 23, 2016

Filed:

Dec. 20, 2013

Electronic component package and method for manufacturing the same

Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Koji Kawakita, Nara, JP;

Seiichi Nakatani, Osaka, JP;

Susumu Sawada, Osaka, JP;

Yoshihisa Yamashita, Kyoto, JP;

Assignee:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Attorney:

Wenderoth, Lind & Ponack, L.L.P.

Primary Examiner:

Tod T Van Roy

Assistant Examiner:

Vu A Vu

Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 23/367 (2006.01); H01L 33/62 (2010.01); H01L 33/64 (2010.01); H01L 33/52 (2010.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/538 (2006.01); H01L 33/50 (2010.01); H01L 23/36 (2006.01); H01L 25/075 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 23/367 (2013.01); H01L 21/4846 (2013.01); H01L 21/4871 (2013.01); H01L 21/56 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 23/3135 (2013.01); H01L 23/36 (2013.01); H01L 23/5389 (2013.01); H01L 24/97 (2013.01); H01L 33/507 (2013.01); H01L 33/52 (2013.01); H01L 33/62 (2013.01); H01L 33/64 (2013.01); H01L 23/3107 (2013.01); H01L 23/49575 (2013.01); H01L 25/0753 (2013.01); H01L 2224/16 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/181 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0066 (2013.01); H01L 2933/0075 (2013.01);
Abstract

A method for manufacturing an electronic component packages is provided, wherein a package precursor is provided, in which an electronic component is embedded in a sealing resin layer such that an electrode of the electronic component is exposed at a surface of the sealing resin layer. A combination of a formation process of a plurality of metal plating layers and a patterning process of the plurality of metal plating layers is provided to form a step-like metal plating layer, the formation process being performed by sequential dry and wet plating processes with respect to the package precursor, and the patterning process being performed by a patterning of at least two of the plurality of metal plating layers.

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