The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2011
Filed:
Mar. 23, 2006
Yoshihisa Yamashita, Kyoto, JP;
Seiji Karashima, Osaka, JP;
Takashi Kitae, Osaka, JP;
Seiichi Nakatani, Osaka, JP;
Toshiyuki Kojima, Kyoto, JP;
Shingo Komatsu, Osaka, JP;
Yoshihisa Yamashita, Kyoto, JP;
Seiji Karashima, Osaka, JP;
Takashi Kitae, Osaka, JP;
Seiichi Nakatani, Osaka, JP;
Toshiyuki Kojima, Kyoto, JP;
Shingo Komatsu, Osaka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
An electronic component mounting method includes a step of applying a resin composition () including solder powder, convective additive and resin having fluidity at the melting temperature of the solder powder on a main surface of a wiring substrate () provided with conductive wirings and connecting terminals, a step of preparing a group of electronic components consisting of a plurality of electronic components (and) including at least a passive component, the respective electronic components comprising electrode terminals, position-aligning connecting terminals with the electrode terminals, and making the group of electronic components abut a surface of the resin composition, a step of heating at least the resin composition so as to melt solder powder and make the solder powder self-assembled between the connecting terminals and the electrode terminals by the convective additive, and thereby connecting the connecting terminals and the electrode terminals by soldering, and a step of fixedly adhering the group of electronic components to the wiring substrate using the resin by hardening the resin in the resin composition. Accordingly, a mounting process can be remarkably simplified without forming bumps in advance.