The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 2007
Filed:
May. 10, 2005
Toshiyuki Asahi, Osaka, JP;
Yasuhiro Sugaya, Toyonaka, JP;
Shingo Komatsu, Kadoma, JP;
Yoshiyuki Yamamoto, Neyagawa, JP;
Seiichi Nakatani, Hirakata, JP;
Toshiyuki Asahi, Osaka, JP;
Yasuhiro Sugaya, Toyonaka, JP;
Shingo Komatsu, Kadoma, JP;
Yoshiyuki Yamamoto, Neyagawa, JP;
Seiichi Nakatani, Hirakata, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A component built-in module includes an insulating layer, wirings integrated with both surfaces of the insulating layer, a via connecting the wirings, and one or more components selected from an electronic component and a semiconductor, which is embedded inside of the insulating layer. In this module, at least one of the wirings is formed on a surface of a wiring board, and the components embedded inside of the insulating layer are mounted on and integrated with the wiring board before embedding. This configuration allows the components such as a semiconductor to undergo a mounting inspection and a property inspection before embedding. As a result, the yields of the module can be improved. In addition, since the components are integrated with the wiring board and embedded, the strength thereof can be enhanced.