The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 22, 2011
Filed:
Feb. 28, 2006
Shingo Komatsu, Osaka, JP;
Seiichi Nakatani, Osaka, JP;
Seiji Karashima, Osaka, JP;
Toshiyuki Kojima, Kyoto, JP;
Takashi Kitae, Osaka, JP;
Yoshihisa Yamashita, Kyoto, JP;
Shingo Komatsu, Osaka, JP;
Seiichi Nakatani, Osaka, JP;
Seiji Karashima, Osaka, JP;
Toshiyuki Kojima, Kyoto, JP;
Takashi Kitae, Osaka, JP;
Yoshihisa Yamashita, Kyoto, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A mounted body of the present invention includes: a multilayer semiconductor chipincluding a plurality of semiconductor chips() that are stacked; and a mounting boardon which the multilayer semiconductor chipis mounted. In this mounted body, each of the semiconductor chips() in the multilayer semiconductor chiphas a plurality of element electrodes() on a chip surface() facing toward the mounting board. On the mounting board, electrode terminalsare formed so as to correspond to the plurality of element electrodes (), respectively, and the electrode terminalsof the mounting board and the element electrodes () are connected electrically to each other via solder bump formed as a result of assembly of solder particles. With this configuration, a mounted body on which a stacked package is mounted can be manufactured easily.