The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2014
Filed:
Dec. 14, 2005
Takashi Kitae, Osaka, JP;
Seiji Karashima, Osaka, JP;
Koichi Hirano, Osaka, JP;
Toshiyuki Kojima, Kyoto, JP;
Seiichi Nakatani, Osaka, JP;
Shingo Komatsu, Osaka, JP;
Yoshihisa Yamashita, Kyoto, JP;
Takashi Kitae, Osaka, JP;
Seiji Karashima, Osaka, JP;
Koichi Hirano, Osaka, JP;
Toshiyuki Kojima, Kyoto, JP;
Seiichi Nakatani, Osaka, JP;
Shingo Komatsu, Osaka, JP;
Yoshihisa Yamashita, Kyoto, JP;
Panasonic Corporation, Osaka, JP;
Abstract
There is provided a flip-chip mounting resin composition which can be used for a flip-chip mounting process that is high in productivity and reliability and thus can be applicable to a flip-chip mounting of a next-generation LSI. This flip-chip mounting resin composition comprises a resin, metal particles and a convection additivethat boils upon heating the resin. Upon the heating of the resin, the metal particles melt and the boiling convection additiveconvects within the resin. This flip-chip mounting resin composition is supplied between a circuit substrateand a semiconductor chip, and subsequently the resinis heated so that the molten metal particles self-assemble into the region between each electrode of the circuit substrate and each electrode of the semiconductor chip. As a result, an electrical connection is formed between each electrode of the circuit substrate and each electrode of the semiconductor chip. Finally, the resinis allowed to cure so that the semiconductor chipis secured to the circuit substrate, which leads to in a formation of a flip chip assembly.