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For the Inventor, By the Inventor

Hsinchu, Taiwan

Sheng-Che Lin

USPTO Granted Patents = 87

Average Co-Inventor Count = 19.1

ph-index = 8

Forward Citations = 257(Granted Patents)

DiyaCoin DiyaCoin = 0.05 


Inventors with similar research interests:


Location History:

  • Baoshan Township, TW (2017 - 2020)
  • Hsinchu, TW (2017 - 2021)

Company Filing History:

goldMedal87 out of 203 
 
Pdf Solutions, Incorporated
 patents

Years Active: 2017-2021

where 'Filed Patents' based on already Granted Patents

87 patents (USPTO):
1. 11107804 - IC with test structures and e-beam pads embedded within a contiguous standard cell area (2021-08-31),
2. 11081477 - IC with test structures and e-beam pads embedded within a contiguous standard cell area (2021-08-03),
3. 11081476 - IC with test structures and e-beam pads embedded within a contiguous standard cell area (2021-08-03),
4. 11075194 - IC with test structures and E-beam pads embedded within a contiguous standard cell area (2021-07-27),
5. 11018126 - IC with test structures and e-beam pads embedded within a contiguous standard cell area (2021-05-25),
6. 10978438 - IC with test structures and E-beam pads embedded within a contiguous standard cell area (2021-04-13),
7. 10854522 - Method for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one tip-to-side short or leakage, at least one corner short or leakage, and at least one via open or resistance, where such measurements are obtained from non-contact pads associated with respective tip-to-side short, corner short, and via open test areas (2020-12-01),
8. 10777472 - IC with test structures embedded within a contiguous standard cell area (2020-09-15),
9. 10593604 - Process for making semiconductor dies, chips, and wafers using in-line measurements obtained from DOEs of NCEM-enabled fill cells (2020-03-17),
10. 10546792 - Method for manufacturing a semiconductor product wafer (2020-01-28),
11. 10410735 - Direct access memory characterization vehicle (2019-09-10),
12. 10380305 - Direct probing characterization vehicle for transistor, capacitor and resistor testing (2019-08-13),
13. 10290552 - Methods for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one via-chamfer short or leakage, and at least one corner short or leakage, where such measurements are obtained from cells with respective tip-to-tip short, via-chamfer short, and corner short test areas, using a charged particle-beam inspector with beam deflection to account for motion of the stage (2019-05-14),
14. 10269786 - Integrated circuit containing first and second DOEs of standard Cell Compatible, NCEM-enabled Fill Cells, with the first DOE including tip-to-side short configured fill cells, and the second DOE including corner short configured fill cells (2019-04-23),
15. 10211112 - Method for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one tip-to-side short or leakage, and at least one side-to-side short or leakage, where such measurements are obtained from non-contact pads associated with respective tip-to-tip short, tip-to-side short, and side-to-side short test areas (2019-02-19),

Title: Innovations of Sheng-Che Lin: A Leading Inventor in Integrated Circuits

Introduction: Sheng-Che Lin is a prominent inventor based in Hsinchu, Taiwan, known for his remarkable contributions to the field of integrated circuits. With a total of 87 patents to his name, Lin has made significant advancements that push the boundaries of technology. His innovations focus on enhancing manufacturing processes and the efficiency of electronic devices.

Latest Patents: Among Sheng-Che Lin's latest contributions are his groundbreaking patents related to integrated circuits. One noteworthy invention is an integrated circuit (IC) that features test structures and electron-beam (e-beam) pads embedded within a contiguous standard cell area. This design includes a 4x3 e-beam pad that is compatible with advanced manufacturing processes, along with an associated e-beam testable structure. This innovation promises to streamline the testing and production processes for high-performance electronic components.

Career Highlights: Sheng-Che Lin has established a distinguished career at Pdf Solutions, Incorporated, where he has been instrumental in driving innovative projects and technical advancements. His expertise in integrated circuit design has positioned him as a key player in the semiconductor industry.

Collaborations: Throughout his career, Lin has collaborated with esteemed colleagues such as Kimon Michaels and Hans Eisenmann. These partnerships have allowed for the exchange of ideas and fostered an environment of creativity, leading to groundbreaking solutions in integrated circuit technology.

Conclusion: Sheng-Che Lin stands out as an influential inventor whose work in integrated circuits continues to shape the future of electronics. With an impressive portfolio of patents and collaborations with other talented individuals, Lin's commitment to innovation and excellence is evident. His contributions are not only making waves within Pdf Solutions, Incorporated but also advancing the industry as a whole.

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