Monte Sereno, CA, United States of America

Kimon Michaels

This inventor holds 90 USPTO granted patents, primarily in Semiconductor Testing (CPC class H01L27-0207). Top assignee: Pdf Solutions, Incorporated. Active years: 2005-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kimon Michaels. Retrieved from https://idiyas.com/inventor/kimon-michaels

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 90

% Patents Active = 8.9

Average Co-Inventor Count = 22.2

ph-index = 9

Forward Citations = 422(Granted Patents)

Forward Citations (Not Self Cited) = 363(Dec 10, 2025)

Inventors with similar research interests:

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Location History:

San Jose, CA (US) (2005 - 2010)
Monte Sereno, CA (US) (2017 - 2021)

Company Filing History:

90 out of 203

Pdf Solutions, Incorporated

patents

Years Active: 2005-2021

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Areas of Expertise:

Non-Contact Measurements

Integrated Circuits

Electrical Characterization

Fill Cells

Test Structures

Wafer Processing

Leakage Detection

Short Testing

90 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11107804 - IC with test structures and e-beam pads embedded within a contiguous standard cell area (2021-08-31),

2. 11081477 - IC with test structures and e-beam pads embedded within a contiguous standard cell area (2021-08-03),

3. 11081476 - IC with test structures and e-beam pads embedded within a contiguous standard cell area (2021-08-03),

4. 11075194 - IC with test structures and E-beam pads embedded within a contiguous standard cell area (2021-07-27),

5. 11018126 - IC with test structures and e-beam pads embedded within a contiguous standard cell area (2021-05-25),

6. 10978438 - IC with test structures and E-beam pads embedded within a contiguous standard cell area (2021-04-13),

7. 10854522 - Method for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one tip-to-side short or leakage, at least one corner short or leakage, and at least one via open or resistance, where such measurements are obtained from non-contact pads associated with respective tip-to-side short, corner short, and via open test areas (2020-12-01),

8. 10777472 - IC with test structures embedded within a contiguous standard cell area (2020-09-15),

9. 10593604 - Process for making semiconductor dies, chips, and wafers using in-line measurements obtained from DOEs of NCEM-enabled fill cells (2020-03-17),

10. 10410735 - Direct access memory characterization vehicle (2019-09-10),

11. 10380305 - Direct probing characterization vehicle for transistor, capacitor and resistor testing (2019-08-13),

12. 10290552 - Methods for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one via-chamfer short or leakage, and at least one corner short or leakage, where such measurements are obtained from cells with respective tip-to-tip short, via-chamfer short, and corner short test areas, using a charged particle-beam inspector with beam deflection to account for motion of the stage (2019-05-14),

13. 10269786 - Integrated circuit containing first and second DOEs of standard Cell Compatible, NCEM-enabled Fill Cells, with the first DOE including tip-to-side short configured fill cells, and the second DOE including corner short configured fill cells (2019-04-23),

14. 10211112 - Method for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one tip-to-side short or leakage, and at least one side-to-side short or leakage, where such measurements are obtained from non-contact pads associated with respective tip-to-tip short, tip-to-side short, and side-to-side short test areas (2019-02-19),

15. 10211111 - Method for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one tip-to-side short or leakage, and at least one corner short or leakage, where such measurements are obtained from non-contact pads associated with respective tip-to-tip short, tip-to-side sort, and corner short test areas (2019-02-19),

Title: The Innovative Journey of Kimon Michaels

Introduction: Kimon Michaels, a renowned inventor based in Monte Sereno, California, has made significant contributions to the field of integrated circuits (ICs). With a remarkable portfolio of 90 patents, he has established himself as a key figure in the tech industry, particularly through his innovative work at Pdf Solutions, Incorporated.

Latest Patents: Among his latest inventions is the groundbreaking "IC with test structures and e-beam pads embedded within a contiguous standard cell area." This innovative IC incorporates a contiguous standard cell area with a 4x3 e-beam pad that is not only compatible with advanced manufacturing processes but also features an associated e-beam testable structure. Such advancements are crucial for the development of more efficient and effective integrated circuits.

Career Highlights: Kimon's career at Pdf Solutions, Incorporated, has been marked by his ability to push the boundaries of integrated circuit design. His expertise in manufacturing processes and circuit testing has been pivotal in enhancing the performance and reliability of electronic devices. The solutions he has developed have greatly influenced how modern electronics are designed and tested.

Collaborations: Throughout his career, Kimon has collaborated with several talented professionals, including Christopher Hess and John Kibarian. Their collective efforts have resulted in innovative solutions that address complex challenges in the semiconductor industry, further underscoring the importance of teamwork in driving technological advancements.

Conclusion: Kimon Michaels continues to be a driving force in the realm of integrated circuits, with his extensive patent portfolio reflecting his commitment to innovation. His work at Pdf Solutions, Incorporated, alongside esteemed colleagues, showcases the potential for groundbreaking inventions in the electronics industry. As technology advances, the contributions of inventors like Kimon will undoubtedly pave the way for future innovations.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]