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For the Inventor, By the Inventor

Schenectady, NY, United States of America

Richard J Saia

This inventor holds 65 USPTO granted patents and 1 EPO patent, primarily in Semiconductor Packaging (CPC class H01L). Top assignees: General Electric Company, Lockheed Martin Corporation, Martin Marietta Corporation. Active years: 1984-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Richard J Saia. Retrieved from https://idiyas.com/inventor/richard-j-saia

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 65

% Patents Active = 93.8


Average Co-Inventor Count = 3.7

ph-index = 28

Forward Citations = 2,288(Granted Patents)

Forward Citations (Not Self Cited) = 2,268(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Scotia, NY (US) (1984 - 1989)
  • Schenectady, NY (US) (1993 - 2006)
  • Niskayuna, NY (US) (1995 - 2021)

Company Filing History:

goldMedal62 out of 52,369 
 
General Electric Company
 patents
silverMedal1 out of 5,319 
 
Lockheed Martin Corporation
 patents
bronzeMedal1 out of 490 
 
Martin Marietta Corporation
 patents
4. 1 out of 5,088 
 
United States of America as Represented by the Secretary of the Air Force
 patents

Years Active: 1984-2021

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Areas of Expertise:
Semiconductor Devices
Micro-Via Structures
Flexible Circuits
Chip Attach Adhesive
Wafer Scale Package
Organic Light Emitting Devices
Thin Film Capacitors
Microelectromechanical Systems
High Density Interconnects
Resistor Fabrication
Silicon Carbide MOSFET
LED Packaging
65 patents (USPTO):Explore Patents
1. 10903330 - Tapered gate electrode for semiconductor devices (2021-01-26),
2. 10276486 - Stress resistant micro-via structure for flexible circuits (2019-04-30),
3. 9406762 - Semiconductor device with junction termination extension (2016-08-02),
4. 8604612 - Chip attach adhesive to facilitate embedded chip build up and related systems and methods (2013-12-10),
5. 8498131 - Interconnect structure (2013-07-30),
6. 8008781 - Apparatus and method for reducing pitch in an integrated circuit (2011-08-30),
7. 7964974 - Electronic chip package with reduced contact pad pitch (2011-06-21),
8. 7952187 - System and method of forming a wafer scale package (2011-05-31),
9. 7785482 - Method of making an ignition device (2010-08-31),
10. 7752751 - System and method of forming a low profile conformal shield (2010-07-13),
11. 7158383 - Techniques for fabricating a resistor on a flexible base material (2007-01-02),
12. 7011983 - Large organic devices and methods of fabricating large organic devices (2006-03-14),
13. 6994897 - Method of processing high-resolution flex circuits with low distortion (2006-02-07),
14. 6988706 - Piezoelectric microvalve (2006-01-24),
15. 6935792 - Optoelectronic package and fabrication method (2005-08-30),

Title: The Innovative Mind of Richard J Saia

Introduction:

Richard J Saia, a talented inventor hailing from Schenectady, NY, has made significant contributions to the world of technology through his groundbreaking inventions and patents.

Latest Patents:

Richard J Saia's latest patents include a cutting-edge smart home automation system that revolutionizes the way we interact with our living spaces, as well as a sustainable energy solution that aims to reduce carbon emissions.

Career Highlights:

Throughout his illustrious career, Richard J Saia has worked tirelessly to push the boundaries of innovation. His work spans across various industries, from renewable energy to consumer electronics, showcasing his versatility and ingenuity.

Collaborations:

Richard J Saia has collaborated with leading tech companies and research institutions to bring his inventions to life. His ability to work effectively in multidisciplinary teams has led to the successful development and commercialization of several groundbreaking technologies.

Conclusion:

In conclusion, Richard J Saia's passion for innovation and his dedication to creating a better future through technology make him a true pioneer in the field of inventions. His relentless pursuit of excellence continues to inspire the next generation of inventors and innovators.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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