The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 30, 2011
Filed:
Dec. 02, 2008
Raymond Albert Fillion, Niskayuna, NY (US);
Kevin M. Durocher, Waterford, NY (US);
Richard Joseph Saia, Niskayuna, NY (US);
Paul Alan Mcconnelee, Albany, NY (US);
Raymond Albert Fillion, Niskayuna, NY (US);
Kevin M. Durocher, Waterford, NY (US);
Richard Joseph Saia, Niskayuna, NY (US);
Paul Alan McConnelee, Albany, NY (US);
General Electric Company, Schenectady, NY (US);
Abstract
An apparatus and method, the apparatus includes an electronic chip package including an electronic chip having a first contact pad and a second contact pad thereon and being free of an intervening contact pad therebetween, a first dielectric layer coupled to the electronic chip over the first and second contact pads, and a second dielectric layer coupled to the first dielectric layer such that a dielectric layer boundary is formed therebetween. The first dielectric layer has a first contact pad via formed therethrough at a first location corresponding to the first contact pad and extending down thereto. The second dielectric layer has a second contact pad via formed therethrough at a second location corresponding to the second contact pad and extending down thereto such that a second contact pad multi-layer via is formed through the first and second dielectric layers at the second location corresponding to the second contact pad.