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For the Inventor, By the Inventor

Waterford, NY, United States of America

Kevin Matthew Durocher

This inventor holds 64 USPTO granted patents and 3 published patent applications and 7 EPO patents, primarily in Integrated Circuit Packaging (CPC class H01L). Top assignees: General Electric Company, Lockheed Martin Corporation, Martin Marietta Corporation. Active years: 1995-2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kevin Matthew Durocher. Retrieved from https://idiyas.com/inventor/kevin-matthew-durocher

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 64 

% Patents Active = 87.5

 

Average Co-Inventor Count = 3.9

ph-index = 17

Forward Citations = 1,395(Granted Patents)

Forward Citations (Not Self Cited) = 1,375(Dec 10, 2025)


Inventors with similar research interests:


Company Filing History:

goldMedal59 out of 52,387 
 
General Electric Company
 patents
silverMedal2 out of 5,320 
 
Lockheed Martin Corporation
 patents
bronzeMedal1 out of 490 
 
Martin Marietta Corporation
 patents
4. 1 out of 5,091 
 
United States of America as Represented by the Secretary of the Air Force
 patents
5. 1 out of 834,513 
Other
 patents

Years Active: 1995-2019

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Areas of Expertise:
Flexible Circuit
Integrated Circuit Package
Electrical Interconnect
Chip Package Build-Up
Ultrasound Acoustic Assemblies
Thermal Interface Element
X-Ray Detection
Sensor Array
Multichip Module
Wafer Scale Package
Microelectromechanical Systems
Electronic Device Cooling
64 patents (USPTO):Explore Patents
1. 10499509 - Methods and systems for a flexible circuit (2019-12-03),
2. 10068840 - Electrical interconnect for an integrated circuit package and method of making same (2018-09-04),
3. 9679837 - Electrical interconnect for an integrated circuit package and method of making same (2017-06-13),
4. 9570376 - Electrical interconnect for an integrated circuit package and method of making same (2017-02-14),
5. 9299647 - Electrical interconnect for an integrated circuit package and method of making same (2016-03-29),
6. 8904631 - Method of fabricating an interconnect device (2014-12-09),
7. 8853550 - Circuit board including mask for controlling flow of solder (2014-10-07),
8. 8829690 - System of chip package build-up (2014-09-09),
9. 8824635 - Detector modules for imaging systems and methods of manufacturing (2014-09-02),
10. 8742646 - Ultrasound acoustic assemblies and methods of manufacture (2014-06-03),
11. 8742558 - Component protection for advanced packaging applications (2014-06-03),
12. 8653670 - Electrical interconnect for an integrated circuit package and method of making same (2014-02-18),
13. 8623699 - Method of chip package build-up (2014-01-07),
14. 8498131 - Interconnect structure (2013-07-30),
15. 8492762 - Electrical interface for a sensor array (2013-07-23),

Title: Kevin Matthew Durocher - Innovative Inventor from Waterford, NY

Introduction: Kevin Matthew Durocher is a talented inventor hailing from Waterford, NY, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Kevin Matthew Durocher holds several patents in various technological domains, showcasing his versatility and creativity in inventing new solutions to modern challenges.

Career Highlights: Throughout his illustrious career, Kevin Matthew Durocher has consistently pushed the boundaries of innovation, with his inventions revolutionizing industries and improving the lives of many.

Collaborations: Kevin Matthew Durocher has collaborated with leading tech companies and research institutions, pooling his expertise with other visionaries to create cutting-edge solutions that have left a lasting impact.

Conclusion: Kevin Matthew Durocher's passion for innovation and his dedication to creating transformative technologies make him a true pioneer in the world of inventors, inspiring future generations to think outside the box and pursue their creative visions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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