The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2014
Filed:
May. 21, 2008
Paul Alan Mcconnelee, Schenectady, NY (US);
Arun Virupaksha Gowda, Rexford, NY (US);
Elizabeth Ann Burke, Mechanicville, NY (US);
Kevin Matthew Durocher, Waterford, NY (US);
Paul Alan McConnelee, Schenectady, NY (US);
Arun Virupaksha Gowda, Rexford, NY (US);
Elizabeth Ann Burke, Mechanicville, NY (US);
Kevin Matthew Durocher, Waterford, NY (US);
General Electric Company, Niskayuna, NY (US);
Abstract
A method of protecting sensitive components prior to, during or subsequent to advanced die packaging processing includes applying a metal stack layer such as titanium/copper (Ti/Cu) onto the front surface of a die assembly such that the die assembly front surface is covered with the metal stack layer. A layer of titanium/copper/titanium (Ti/Cu/Ti) or a solder alloy is also applied to the back surface of the die assembly such that the back surface of the die assembly is covered with the Ti/Cu/Ti layer or solder alloy. The front surface metal stack layer and the back surface Ti/Cu/Ti layer or solder alloy prevent degradation of die metallization prior to, during or subsequent to the advanced die packaging processing.