Arun Virupaksha Gowda

This inventor holds 64 USPTO granted patents and 8 published patent applications, plus 3 CIPO patents and 15 EPO patents, primarily in Electronic Packaging (CPC class H01L). Top assignees: General Electric Company, Ge Aviation Systems Limited. Active years: 2006-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Arun Virupaksha Gowda. Retrieved from https://idiyas.com/inventor/arun-virupaksha-gowda

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 64 (Patent Applications = 8)

% Patents Active = 95.3

CIPO Patents = 3 (Patent Applications = 1)

EPO Patents = 15 (Patent Applications = 28)

Average Co-Inventor Count = 2.8

ph-index = 10

Forward Citations = 344(Granted Patents)

Forward Citations (Not Self Cited) = 253(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Schenectady, NY (US) (2006)
Niskayuna, NY (US) (2007 - 2014)
Rexford, NY (US) (2011 - 2024)

Company Filing History:

60 out of 52,387

General Electric Company

patents

4 out of 691

Ge Aviation Systems Limited

patents

Years Active: 2006-2026

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Areas of Expertise:

Electronic Package

Power Overlay Module

Semiconductor Device

Interconnect Assembly

Thermal Storage

Stacked Electronics

Embedded Device

Multi-Thickness Conductor

Integrated Circuit

Electrical Interconnect

Surface Mount Module

Three-Dimensional Stacking

64 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12635544 - Power overlay package for a semiconductor device coupled to a POL-RDL package (2026-05-19),

2. 12322916 - Electronic connection assembly (2025-06-03),

3. 12237243 - Power overlay module with thermal storage (2025-02-25),

4. 12034033 - Semiconductor device package and method of forming (2024-07-09),

5. 11605609 - Ultra-thin embedded semiconductor device package and method of manufacturing thereof (2023-03-14),

6. 11551993 - Power overlay module and method of assembling (2023-01-10),

7. 11177204 - Power electronics package and method of manufacturing thereof (2021-11-16),

8. 10770444 - Electronics package having a multi-thickness conductor layer and method of manufacturing thereof (2020-09-08),

9. 10700035 - Stacked electronics package and method of manufacturing thereof (2020-06-30),

10. RE48015 - Interconnect devices for electronic packaging assemblies (2020-05-25),

11. 10607957 - Ultra-thin embedded semiconductor device package and method of manufacturing thereof (2020-03-31),

12. 10607929 - Electronics package having a self-aligning interconnect assembly and method of making same (2020-03-31),

13. 10553556 - Electronics package having a multi-thickness conductor layer and method of manufacturing thereof (2020-02-04),

14. 10453786 - Power electronics package and method of manufacturing thereof (2019-10-22),

15. 10312194 - Stacked electronics package and method of manufacturing thereof (2019-06-04),

Title: The Innovative Journey of Arun Virupaksha Gowda

Introduction: Arun Virupaksha Gowda is a pioneering inventor based in Rexford, NY (US) known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Arun Virupaksha Gowda holds several patents in the areas of artificial intelligence, renewable energy, and biotechnology, showcasing his diverse range of expertise and innovative thinking.

Career Highlights: With a career spanning over two decades, Arun Virupaksha Gowda has worked with leading tech companies, research institutions, and universities, consistently pushing the boundaries of what is possible in the world of inventions.

Collaborations: Throughout his career, Arun Virupaksha Gowda has collaborated with top scientists, engineers, and researchers from around the globe, fostering a culture of innovation and creativity in all his projects.

Conclusion: Arun Virupaksha Gowda's relentless pursuit of innovation and his passion for creating solutions to complex problems have solidified his reputation as a visionary inventor in the industry.

Profile summary based on public USPTO records.