Arun Virupaksha Gowda

USPTO Granted Patents = 63 (Patent Applications = 7)

CIPO Patents = 2 (Patent Applications = 2)

EPO Patents = 14 (Patent Applications = 28)

Average Co-Inventor Count = 2.7

ph-index = 10

Forward Citations = 328(Granted Patents)

DiyaCoin

= 0.61

Inventors with similar research interests:

Location History:

Schenectady, NY (US) (2006)
Niskayuna, NY (US) (2007 - 2014)
Rexford, NY (US) (2011 - 2024)

Company Filing History:

59 out of 51,873

General Electric Company

patents

4 out of 670

Ge Aviation Systems Limited

patents

Years Active: 2006-2025

where 'Filed Patents' based on already Granted Patents

63 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 12322916 - Electronic connection assembly (2025-06-03),

2. 12237243 - Power overlay module with thermal storage (2025-02-25),

3. 12034033 - Semiconductor device package and method of forming (2024-07-09),

4. 11605609 - Ultra-thin embedded semiconductor device package and method of manufacturing thereof (2023-03-14),

5. 11551993 - Power overlay module and method of assembling (2023-01-10),

6. 11177204 - Power electronics package and method of manufacturing thereof (2021-11-16),

7. 10770444 - Electronics package having a multi-thickness conductor layer and method of manufacturing thereof (2020-09-08),

8. 10700035 - Stacked electronics package and method of manufacturing thereof (2020-06-30),

9. RE48015 - Interconnect devices for electronic packaging assemblies (2020-05-25),

10. 10607957 - Ultra-thin embedded semiconductor device package and method of manufacturing thereof (2020-03-31),

11. 10607929 - Electronics package having a self-aligning interconnect assembly and method of making same (2020-03-31),

12. 10553556 - Electronics package having a multi-thickness conductor layer and method of manufacturing thereof (2020-02-04),

13. 10453786 - Power electronics package and method of manufacturing thereof (2019-10-22),

14. 10312194 - Stacked electronics package and method of manufacturing thereof (2019-06-04),

15. 10269688 - Power overlay structure and method of making same (2019-04-23),

Title: The Innovative Journey of Arun Virupaksha Gowda

Introduction: Arun Virupaksha Gowda is a pioneering inventor based in Rexford, NY (US) known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Arun Virupaksha Gowda holds several patents in the areas of artificial intelligence, renewable energy, and biotechnology, showcasing his diverse range of expertise and innovative thinking.

Career Highlights: With a career spanning over two decades, Arun Virupaksha Gowda has worked with leading tech companies, research institutions, and universities, consistently pushing the boundaries of what is possible in the world of inventions.

Collaborations: Throughout his career, Arun Virupaksha Gowda has collaborated with top scientists, engineers, and researchers from around the globe, fostering a culture of innovation and creativity in all his projects.

Conclusion: Arun Virupaksha Gowda's relentless pursuit of innovation and his passion for creating solutions to complex problems have solidified his reputation as a visionary inventor in the industry.

This text is generated by artificial intelligence and may not be accurate.