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For the Inventor, By the Inventor

Rexford, NY, United States of America

Arun Virupaksha Gowda

USPTO Granted Patents = 63 

 

 

Average Co-Inventor Count = 2.7

ph-index = 10

Forward Citations = 329(Granted Patents)

Forward Citations (Not Self Cited) = 253(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Schenectady, NY (US) (2006)
  • Niskayuna, NY (US) (2007 - 2014)
  • Rexford, NY (US) (2011 - 2024)

Company Filing History:

goldMedal59 out of 51,907 
 
General Electric Company
 patents
silverMedal4 out of 671 
 
Ge Aviation Systems Limited
 patents

Years Active: 2006-2025

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Areas of Expertise:
Electronic Connection Assembly
Power Overlay Module
Semiconductor Device Package
Embedded Semiconductor Device Package
Power Electronics Package
Electrical Interconnect Structure
Three-Dimensional Stacked Integrated Circuits
Overlay Circuit Structure
Integrated Circuit Package
Surface Mount Integrated Power Module
Interconnect Devices
Thermal Storage
63 patents (USPTO):Explore Patents
1. 12322916 - Electronic connection assembly (2025-06-03),
2. 12237243 - Power overlay module with thermal storage (2025-02-25),
3. 12034033 - Semiconductor device package and method of forming (2024-07-09),
4. 11605609 - Ultra-thin embedded semiconductor device package and method of manufacturing thereof (2023-03-14),
5. 11551993 - Power overlay module and method of assembling (2023-01-10),
6. 11177204 - Power electronics package and method of manufacturing thereof (2021-11-16),
7. 10770444 - Electronics package having a multi-thickness conductor layer and method of manufacturing thereof (2020-09-08),
8. 10700035 - Stacked electronics package and method of manufacturing thereof (2020-06-30),
9. RE48015 - Interconnect devices for electronic packaging assemblies (2020-05-25),
10. 10607957 - Ultra-thin embedded semiconductor device package and method of manufacturing thereof (2020-03-31),
11. 10607929 - Electronics package having a self-aligning interconnect assembly and method of making same (2020-03-31),
12. 10553556 - Electronics package having a multi-thickness conductor layer and method of manufacturing thereof (2020-02-04),
13. 10453786 - Power electronics package and method of manufacturing thereof (2019-10-22),
14. 10312194 - Stacked electronics package and method of manufacturing thereof (2019-06-04),
15. 10269688 - Power overlay structure and method of making same (2019-04-23),

Title: The Innovative Journey of Arun Virupaksha Gowda

Introduction: Arun Virupaksha Gowda is a pioneering inventor based in Rexford, NY (US) known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Arun Virupaksha Gowda holds several patents in the areas of artificial intelligence, renewable energy, and biotechnology, showcasing his diverse range of expertise and innovative thinking.

Career Highlights: With a career spanning over two decades, Arun Virupaksha Gowda has worked with leading tech companies, research institutions, and universities, consistently pushing the boundaries of what is possible in the world of inventions.

Collaborations: Throughout his career, Arun Virupaksha Gowda has collaborated with top scientists, engineers, and researchers from around the globe, fostering a culture of innovation and creativity in all his projects.

Conclusion: Arun Virupaksha Gowda's relentless pursuit of innovation and his passion for creating solutions to complex problems have solidified his reputation as a visionary inventor in the industry.

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