The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2026

Filed:

Feb. 08, 2023
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Arun Virupaksha Gowda, Rexford, NY (US);

Ljubisa D. Stevanovic, Clifton Park, NY (US);

Christopher James Kapusta, Delanson, NY (US);

Robert Dwayne Gossman, Clifton Park, NY (US);

Risto Ilkka Sakari Tuominen, Helsinki, FI;

Assignee:

General Electric Company, Evendale, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 21/486 (2013.01); H01L 23/49861 (2013.01);
Abstract

A semiconductor assembly includes a semiconductor device and a POL-RDL package coupled to said device. The device includes an upper surface, a gate pad and at least one source pad disposed on said upper surface. The POL-RDL package includes a dielectric layer having at least one source pad electrically coupled to said at least one source pad of said device and at least one contact pad disposed. At least one trace connection having a resistivity value electrically couples said at least one source pad of said POL-RDL package to said at least one contact pad.


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