The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 09, 2014

Filed:

Apr. 15, 2011
Applicants:

Kevin Matthew Durocher, Waterford, NY (US);

William Edward Burdick, Jr., Niskayuna, NY (US);

Yuru Alexeyevich Plotnikov, Niskayuna, NY (US);

David Decrescente, Jr., Schenectady, NY (US);

Inventors:

Kevin Matthew Durocher, Waterford, NY (US);

William Edward Burdick, Jr., Niskayuna, NY (US);

Yuru Alexeyevich Plotnikov, Niskayuna, NY (US);

David DeCrescente, Jr., Schenectady, NY (US);

Assignee:

General Electric Company, Niskayuna, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/02 (2006.01); H05K 3/10 (2006.01); H05K 3/24 (2006.01); H05K 3/42 (2006.01); H05K 1/03 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 3/246 (2013.01); H05K 3/242 (2013.01); H05K 3/42 (2013.01); H05K 1/0393 (2013.01); H05K 3/4069 (2013.01);
Abstract

An interconnect device and a method for fabricating same. An embodiment of the invention includes sequential steps of providing a flexible substrate, forming vias through the flexible substrate, applying a conductive seed layer including first and second portions, applying conductive materials including first and second portions, copper plating the substrate, and then removing the second portions of the conductive seed layer and the conductive materials.


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