The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 13, 2017

Filed:

Mar. 28, 2016
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Paul Alan McConnelee, Albany, NY (US);

Kevin Matthew Durocher, Waterford, NY (US);

Scott Smith, Niskayuna, NY (US);

Donald Paul Cunningham, Dallas, TX (US);

Assignee:

General Electric Company, Schenectady, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 23/49805 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/49866 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 24/82 (2013.01); H01L 23/49833 (2013.01); H01L 2224/92144 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/14 (2013.01);
Abstract

An electrical interconnect assembly includes an insulating substrate, upper conductive pads coupled to a top surface of the insulating substrate, and lower conductive pads coupled to a bottom surface of the insulating substrate. The upper conductive pads and the lower conductive pads comprise an electrically conductive material. A metallization layer is deposited on the top surface of the insulating substrate and the upper conductive pads. The metallization layer extends through vias formed through a thickness of the insulating substrate to contact a top surface of the lower conductive pads.


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