Scott Sheridan Smith

Title: Scott Sheridan Smith: Innovator in Electrical Interconnect Technology

Introduction

Scott Sheridan Smith is a prominent inventor based in Scotia, NY (US). He has made significant contributions to the field of electrical interconnect technology, holding a total of 11 patents. His work focuses on enhancing the efficiency and functionality of integrated circuit packages.

Latest Patents

Among his latest patents is the "Electrical interconnect for an integrated circuit package and method of making same." This invention features an electrical interconnect assembly designed for use in integrated circuit packages. It includes a mounting substrate with a defined thickness and at least one electrically conductive pad on its surface. A metallization layer coats the conductive pad and extends through vias formed in the substrate. This innovative method of manufacturing the assembly involves forming top side contact pads and depositing a metallization layer on both the pads and the substrate.

Another notable patent is also titled "Electrical interconnect for an integrated circuit package and method of making same." This version includes an insulating substrate with upper and lower conductive pads. The metallization layer is deposited on the substrate and extends through vias to connect with the lower conductive pads, showcasing Smith's expertise in creating efficient electrical interconnect solutions.

Career Highlights

Scott Sheridan Smith is currently employed at General Electric Company, where he continues to develop cutting-edge technologies. His work has significantly impacted the field of electrical engineering, particularly in the design and manufacturing of integrated circuits.

Collaborations

Throughout his career, Smith has collaborated with notable colleagues, including Paul Alan McConnelee and Kevin Matthew Durocher. These partnerships have fostered innovation and contributed to the advancement of electrical interconnect technologies.

Conclusion

Scott Sheridan Smith is a distinguished inventor whose work in electrical interconnect technology has led to numerous patents and advancements in the field. His contributions continue to shape the future of integrated circuit design and manufacturing.