The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2014
Filed:
Feb. 25, 2011
Applicants:
Arun Virupaksha Gowda, Niskayuna, NY (US);
Kevin Matthew Durocher, Waterford, NY (US);
James Wilson Rose, Guilderland, NY (US);
Paul Jeffrey Gillespie, Scotia, NY (US);
Richard Alfred Beaupre, Pittsfield, MA (US);
David Richard Esler, Schenectady, NY (US);
Inventors:
Arun Virupaksha Gowda, Niskayuna, NY (US);
Kevin Matthew Durocher, Waterford, NY (US);
James Wilson Rose, Guilderland, NY (US);
Paul Jeffrey Gillespie, Scotia, NY (US);
Richard Alfred Beaupre, Pittsfield, MA (US);
David Richard Esler, Schenectady, NY (US);
Assignee:
General Electric Company, Niskayuna, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 3/34 (2006.01); B23K 35/30 (2006.01); B23K 35/36 (2006.01); B23K 35/38 (2006.01); B23K 35/28 (2006.01); B23K 35/32 (2006.01); B23K 3/06 (2006.01); H05K 3/24 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
B23K 3/06 (2013.01); H05K 3/3452 (2013.01); H05K 3/244 (2013.01); H05K 3/0061 (2013.01); B23K 35/308 (2013.01); B23K 35/3606 (2013.01); B23K 35/38 (2013.01); B23K 35/286 (2013.01); B23K 35/325 (2013.01); H05K 2201/2081 (2013.01);
Abstract
A circuit board includes a solder wettable surface and a metal mask configured to restrict solder from flowing outside the solder wettable surface of the circuit board.