The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 30, 2005

Filed:

Oct. 21, 2002
Applicants:

Richard Joseph Saia, Niskayuna, NY (US);

Thomas Bert Gorczyca, Schenectady, NY (US);

Christopher James Kapusta, Duanesburg, NY (US);

Ernest Wayne Balch, Ballston Spa, NY (US);

Glenn Scott Claydon, Wynantskill, NY (US);

Samhita Dasgupta, Niskayuna, NY (US);

Eladio Clemente Delgado, Burnt Hills, NY (US);

Inventors:

Richard Joseph Saia, Niskayuna, NY (US);

Thomas Bert Gorczyca, Schenectady, NY (US);

Christopher James Kapusta, Duanesburg, NY (US);

Ernest Wayne Balch, Ballston Spa, NY (US);

Glenn Scott Claydon, Wynantskill, NY (US);

Samhita Dasgupta, Niskayuna, NY (US);

Eladio Clemente Delgado, Burnt Hills, NY (US);

Assignee:

General Electric Company, Niskayuna, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G02B006/00 ;
U.S. Cl.
CPC ...
Abstract

An optoelectronic package is fabricated by a method which includes: positioning an optical device within a window of a substrate active-side up and below a top substrate surface; filling the window with an optical polymer material; planarizing surfaces of the optical polymer material and the substrate; patterning waveguide material over the optical polymer material and the substrate to form an optical interconnection path; and to form a mirror to reflect light from the optical device to the interconnection path; and forming a via to expose a bond pad of the optical device.


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