The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 21, 2011
Filed:
Dec. 02, 2008
Raymond Albert Fillion, Niskayuna, NY (US);
Kevin M. Durocher, Waterford, NY (US);
Richard Joseph Saia, Niskayuna, NY (US);
Paul Alan Mcconnelee, Albany, NY (US);
Raymond Albert Fillion, Niskayuna, NY (US);
Kevin M. Durocher, Waterford, NY (US);
Richard Joseph Saia, Niskayuna, NY (US);
Paul Alan McConnelee, Albany, NY (US);
General Electric Company, Schenectady, NY (US);
Abstract
An apparatus and method, the apparatus includes an electronic chip package including an electronic chip having a first and a second contact pad formed thereon, a first dielectric layer coupled to the electronic chip, a second dielectric layer coupled to the first dielectric layer such that a dielectric boundary lies therebetween, a first and a second cover pad positioned along the dielectric boundary, a metal interconnect formed along a first multi-layer via and coupled to the first cover pad and contact pad, and a metal interconnect formed along a second multi-layer via and coupled to the second cover pad and contact pad. The first multi-layer via extends through the second dielectric layer, the first cover pad, and the first dielectric layer to the first contact pad. The second multi-layer via extends through the second dielectric layer, the second cover pad, and the first dielectric layer to the second contact pad.