Raashina Humayun

This inventor holds 70 USPTO granted patents and 13 published patent applications, primarily in Tungsten Deposition (CPC class H01L). Top assignees: Novellus Systems Incorporated, Lam Research Corporation. Active years: 2004-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Raashina Humayun. Retrieved from https://idiyas.com/inventor/raashina-humayun

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 70 (Patent Applications = 13)

% Patents Active = 75.7

Average Co-Inventor Count = 4.4

ph-index = 27

Forward Citations = 3,673(Granted Patents)

Forward Citations (Not Self Cited) = 3,083(Dec 10, 2025)

Inventors with similar research interests:

Location History:

San Jose, CA (US) (2004 - 2009)
Sunnyvale, CA (US) (2007 - 2011)
Fremont, CA (US) (2004 - 2017)
Los Altos, CA (US) (2014 - 2024)

Company Filing History:

42 out of 993

Novellus Systems Incorporated

patents

28 out of 3,945

Lam Research Corporation

patents

Years Active: 2004-2025

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Areas of Expertise:

Tungsten Feature Fill

Alloy Atomic Layer Deposition

Low Resistivity Films

Nucleation Inhibition

Cobalt Film Deposition

Metal Fill Process

Void-Free Fill

Interconnect Metallization

Manganese Barrier Layers

Sequential CVD Process

Three-Dimensional Features

Tensile Tungsten Films

70 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12444651 - Tungsten feature fill with nucleation inhibition (2025-10-14),

2. 12331396 - Systems and methods for homogenous intermixing of precursors in alloy atomic layer deposition (2025-06-17),

3. 11901227 - Feature fill with nucleation inhibition (2024-02-13),

4. 11827976 - Systems and methods for homogenous intermixing of precursors in alloy atomic layer deposition (2023-11-28),

5. 11670516 - Metal-containing passivation for high aspect ratio etch (2023-06-06),

6. 11410883 - Tungsten feature fill with nucleation inhibition (2022-08-09),

7. 11348795 - Metal fill process for three-dimensional vertical NAND wordline (2022-05-31),

8. 11075115 - Tungsten feature fill (2021-07-27),

9. 10916434 - Feature fill with multi-stage nucleation inhibition (2021-02-09),

10. 10777453 - Low resistivity films containing molybdenum (2020-09-15),

11. 10731250 - Depositing ruthenium layers in interconnect metallization (2020-08-04),

12. 10580695 - Feature fill with nucleation inhibition (2020-03-03),

13. 10580654 - Feature fill with multi-stage nucleation inhibition (2020-03-03),

14. 10546751 - Forming low resistivity fluorine free tungsten film without nucleation (2020-01-28),

15. 10529722 - Tungsten for wordline applications (2020-01-07),

Title: Top Inventor in Los Altos

Introduction: Ali Khakifirooz is recognized as a leading inventor in the field of technology and innovation. His contributions have significantly impacted various industries.

Latest Patents: Ali has recently been awarded several patents that showcase his inventive prowess and commitment to advancing technology.

Career Highlights: Throughout his career, Ali has achieved numerous milestones, establishing himself as a prominent figure in the innovation landscape.

Collaborations: He has collaborated with various organizations and institutions, further enhancing his impact on the field.

Conclusion: Ali Khakifirooz continues to inspire future generations of inventors with his groundbreaking work and dedication to innovation.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

13 patents pending: