The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2020
Filed:
Jun. 04, 2018
Applicant:
Lam Research Corporation, Fremont, CA (US);
Inventors:
Do Young Kim, Albany, CA (US);
Jeong-Seok Na, San Jose, CA (US);
Chiukin Steven Lai, Sunnyvale, CA (US);
Raashina Humayun, Los Altos, CA (US);
Michal Danek, Cupertino, CA (US);
Assignee:
Lam Research Corporation, Fremont, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/455 (2006.01); C23C 16/18 (2006.01); H01L 23/532 (2006.01); H01L 21/02 (2006.01); H01L 21/768 (2006.01); C23C 16/54 (2006.01); H01L 23/522 (2006.01); C23C 16/509 (2006.01); H01L 21/285 (2006.01); C23C 16/448 (2006.01); C23C 16/52 (2006.01);
U.S. Cl.
CPC ...
C23C 16/45534 (2013.01); C23C 16/18 (2013.01); C23C 16/4486 (2013.01); C23C 16/45536 (2013.01); C23C 16/45542 (2013.01); C23C 16/45553 (2013.01); C23C 16/5096 (2013.01); C23C 16/52 (2013.01); C23C 16/54 (2013.01); H01L 21/0228 (2013.01); H01L 21/02274 (2013.01); H01L 21/28562 (2013.01); H01L 21/76843 (2013.01); H01L 21/76876 (2013.01); H01L 21/76877 (2013.01); H01L 23/5226 (2013.01); H01L 23/53238 (2013.01); H01L 23/53252 (2013.01); H01L 23/53266 (2013.01); H01L 23/53209 (2013.01);
Abstract
In some embodiments, deposition processes for ruthenium (Ru) feature fill include deposition of a thin, protective Ru film under reducing conditions, followed by a Ru fill step under oxidizing conditions. The presence of protective Ru films formed under oxygen-free conditions or with an oxygen-removing operation can enable Ru fill without oxidation of an underlying adhesion layer or metal feature.