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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10529722 B1

PDFFull Text
Date of Patent:
Jan. 07, 2020

Filed:

Mar. 19, 2018

Tungsten for wordline applications

Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventors:

Michal Danek, Cupertino, CA (US);

Hanna Bamnolker, Cupertino, CA (US);

Raashina Humayun, Los Altos, CA (US);

Juwen Gao, San Jose, CA (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:

Weaver Austin Villeneuve & Sampson LLP

Primary Examiner:

Richard A Booth

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 27/108 (2006.01); H01L 21/768 (2006.01); H01L 21/28 (2006.01); H01L 27/11582 (2017.01); H01L 21/285 (2006.01); C23C 16/02 (2006.01); C23C 16/08 (2006.01); C23C 16/30 (2006.01); H01L 27/11556 (2017.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 27/10891 (2013.01); C23C 16/0272 (2013.01); C23C 16/08 (2013.01); C23C 16/30 (2013.01); H01L 21/28088 (2013.01); H01L 21/28562 (2013.01); H01L 21/76843 (2013.01); H01L 21/76876 (2013.01); H01L 21/76877 (2013.01); H01L 27/11582 (2013.01); H01L 23/53257 (2013.01); H01L 23/53266 (2013.01); H01L 27/10823 (2013.01); H01L 27/11556 (2013.01); H01L 29/40117 (2019.08);
Abstract

Disclosed herein are methods and related apparatus for formation of multi-component tungsten-containing films including multi-component tungsten-containing films diffusion barriers. According to various embodiments, the methods involve deposition of multi-component tungsten-containing films using tungsten chloride (WCl) precursors and boron (B)-containing, silicon (Si)-containing or germanium (Ge)-containing reducing agents.

Find Patent Forward Citations

Danek, Michal. (2020). Tungsten for wordline applications (U.S. Patent No. 10529722). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10529722

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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