Inventors with similar research interests:
Location History:
- Santa Clara, CA (US) (1999 - 2002)
- Sunnyvale, CA (US) (2014)
- San Jose, CA (US) (2001 - 2020)
Company Filing History:
Years Active: 1999-2020
Title: Qi Xiang: Innovating the Future of IC Chip Package Assembly
Introduction:
In the ever-evolving field of integrated circuit (IC) chip package assembly, trailblazers like Qi Xiang are revolutionizing techniques and technologies. With an impressive portfolio of 203 patents, Qi Xiang, based in San Jose, CA, has consistently pushed the boundaries of innovation in the semiconductor industry. In this article, we delve into his latest patents, career highlights, collaborations, and his significant contributions to the field.
Latest Patents:
Qi Xiang's latest patents highlight his expertise and ingenuity in IC chip package assembly. One notable invention is the "High Yield Package Assembly Technique," which describes an apparatus and techniques for assembling IC chip packages. This invention focuses on fabricating IC packages with a higher yield by analyzing performance criteria and generating an optimized assembly sequence. Through this innovation, Qi Xiang addresses the critical challenge of enhancing IC package assembly efficiency.
Additionally, Qi Xiang's research includes advancements in asymmetric and stacked transistors, crucial components in semiconductor technology. His invention of "Integrated Circuits with Asymmetric and Stacked Transistors" presents techniques for creating asymmetric transistors using pocket implants and dual-gate structures with different work functions. Furthermore, Qi Xiang's stacked transistor designs offer improvements in reducing leakage currents, particularly in memory cells.
Career Highlights:
Qi Xiang has made significant contributions to various renowned companies in the semiconductor industry. He has applied his expertise and innovation to the development of cutting-edge technologies at prominent organizations such as Advanced Micro Devices Corporation and Altera Corporation. His work in these companies has played a pivotal role in advancing IC chip package assembly techniques and semiconductor device manufacturing.
Collaborations:
Throughout his career, Qi Xiang has collaborated with esteemed professionals in the field. Two notable coworkers include Eric Paton and Paul Raymond Besser. These collaborations have fostered an environment of shared knowledge and expertise, enabling Qi Xiang to join forces with like-minded experts and harness their collective wisdom to drive innovation.
Conclusion:
Qi Xiang's journey in the field of innovations and patents has been characterized by a relentless pursuit of excellence. With a remarkable number of 203 patents, he has demonstrated his ability to envision and implement groundbreaking techniques in IC chip package assembly. Qi Xiang's unparalleled expertise, coupled with his collaborations and contributions to companies such as Advanced Micro Devices Corporation and Altera Corporation, firmly establishes him as a significant figure in the semiconductor industry. As we look toward the future, Qi Xiang's inventions continue to shape and expand the boundaries of integrated circuit technology, driving us towards a more innovative and advanced digital landscape.
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