This inventor holds 116 USPTO granted patents and 11 published patent applications and 14 EPO patents, primarily in Semiconductor Packaging (CPC class H01L2224-16225). Top assignees: Broadcom Corporation, Avago Technologies General IP (Singapore) Pte. Ltd., Avago Technologies International Sales Pte. Limited. Active years: 2001-2020.
Inventors with similar research interests:
Location History:
- Aliso Viejo, CA (US) (2001 - 2013)
- Laguna Niguel, CA (US) (2004 - 2020)
Company Filing History:
113 out of 11,124 
2 out of 1,813 
1 out of 1,019 Years Active: 2001-2020
Areas of Expertise:
Title: Pieter Vorenkamp: A Pioneer in Semiconductor Innovation
Introduction:
Pieter Vorenkamp, a resident of Laguna Niguel, CA (US), is a renowned inventor who has contributed significantly to the field of semiconductor technology. With an impressive total of 115 patents to his name, Vorenkamp has played a pivotal role in advancing the capabilities of semiconductor devices and manufacturing methods. His recent patent, titled "Thin recon interposer package without TSV for fine input/output pitch fan-out," showcases his innovation in creating high-density interfaces and pitch fan-out solutions for active semiconductor dies and substrates.
Patent Description:
The patent outlines the development of a Recon interposer that allows for a compact and efficient connection between active semiconductor dies and semiconductor substrates. By utilizing a combination of silicon pad layers, oxide layers, and interposer dielectric layers, Vorenkamp's design integrates routing traces to establish a connectivity path between the redistribution layer and the interposer dielectric layer.
Furthermore, the patent highlights the incorporation of an integrated circuit (IC) die, attached through a set of IC bumps, and the use of an encapsulating material to provide structural support for the entire circuit assembly. This inventive approach enhances performance and facilitates the fine input/output pitch fan-out.
Career and Collaborations:
Throughout his career, Pieter Vorenkamp has made significant contributions to various corporations in the semiconductor industry. Notably, he has been associated with Avago Technologies International Sales Pte. Limited and Avago Technologies General IP (Singapore) Pte. Ltd. These companies have provided platforms for Vorenkamp to turn his innovative ideas into practical solutions, thereby strengthening their positions in the competitive market.
Working alongside industry experts, Vorenkamp has collaborated with notable colleagues such as Neil Y Kim and Sumant Ranganathan. This collaboration has fostered an environment of creativity and expertise, further driving the advancements in semiconductor technologies associated with his work.
Conclusion:
Pieter Vorenkamp's extensive patent portfolio and impactful contributions to the semiconductor industry confirm his status as an influential innovator. His groundbreaking patents, including the "Thin recon interposer package without TSV for fine input/output pitch fan-out," exemplify his ability to develop solutions that address critical challenges in semiconductor device manufacturing. Vorenkamp's work has not only earned him recognition but has also significantly contributed to the progress and development of the semiconductor industry as a whole.