Rancho Santa Margarita, CA, United States of America

Rezaur Rahman Khan

USPTO Granted Patents = 59 

 

Average Co-Inventor Count = 2.6

ph-index = 14

Forward Citations = 698(Granted Patents)

Forward Citations (Not Self Cited) = 662(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Santa Margarita, CA (US) (2013)
  • Margarita, CA (US) (2015)
  • Rancho Santa Margarita, CA (US) (2007 - 2017)
  • Irvine, CA (US) (2015 - 2020)

Company Filing History:


Years Active: 2007-2020

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Areas of Expertise:
Interposer Package
Semiconductor Packaging
3D IC Integration
Thermal Interface Material
Wafer Level System
Magnetic-Core Inductors
Flexible Routing
Integrated Circuit Stacking
EMI Shielding
High Density Redistribution Layer
Chip Scale Package
Mutual Capacitance Control
59 patents (USPTO):Explore Patents

Title: **Rezaur Rahman Khan: A Pioneer in Semiconductor Innovations**

Introduction

Rezaur Rahman Khan is a distinguished inventor based in Rancho Santa Margarita, California, renowned for his advancements in semiconductor technologies. With an impressive portfolio of 59 patents, Khan's work has significantly contributed to enhancing the performance and efficiency of integrated circuit (IC) packaging techniques.

Latest Patents

Among his latest innovations, Khan has developed a "Thin recon interposer package without TSV for fine input/output pitch fan-out." This technology offers a dense interface between the active semiconductor die and the substrate. His circuit assembly includes features such as a silicon pad layer with multiple metal pads for bump connection, an oxide layer, and an interposer dielectric layer with routing traces. This method improves structural support for the IC die while facilitating high-density routing.

Another groundbreaking invention is the "High density redistribution layer (RDL) interconnect bridge using a reconstituted wafer." This IC package showcases high-density interconnects to connect multiple semiconductor dies, enhancing manufacturing yield and significantly reducing costs. The design employs a first dielectric layer with vias for input/output pads, along with interconnection layers enabling efficient communication between dies.

Career Highlights

Rezaur Rahman Khan has made substantial contributions during his tenure at prominent companies, including Broadcom Corporation and Avago Technologies General IP (Singapore) Pte. Ltd. His work in these organizations has placed him at the forefront of semiconductor innovation, helping to raise industry standards and improve devices' functionalities.

Collaborations

Throughout his career, Khan has collaborated with notable professionals such as Sam Ziqun Zhao and Pieter Vorenkamp. These collaborations have led to the development of several patents that address complex challenges in semiconductor manufacturing and design, further enhancing the capabilities of electronic devices.

Conclusion

Rezaur Rahman Khan's innovative contributions to the semiconductor field have established him as a leading figure in the industry. His extensive patent portfolio reflects his dedication to advancing technology and pushing the boundaries of what's possible in integrated circuit design. With ongoing advancements, the impact of his inventions will continue to resonate in the world of electronics for years to come.

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