This inventor holds 59 USPTO granted patents and 16 published patent applications and 7 EPO patents, primarily in Semiconductor Packaging (CPC class H01L). Top assignees: Broadcom Corporation, Avago Technologies General IP (Singapore) Pte. Ltd., Avago Technologies International Sales Pte. Limited. Active years: 2007-2020.
Inventors with similar research interests:
Location History:
- Santa Margarita, CA (US) (2013)
- Margarita, CA (US) (2015)
- Rancho Santa Margarita, CA (US) (2007 - 2017)
- Irvine, CA (US) (2015 - 2020)
Company Filing History:
52 out of 11,124Â 
5 out of 1,813Â 
2 out of 1,017Â Years Active: 2007-2020
Areas of Expertise:
Title: **Rezaur Rahman Khan: A Pioneer in Semiconductor Innovations**
Introduction
Rezaur Rahman Khan is a distinguished inventor based in Rancho Santa Margarita, California, renowned for his advancements in semiconductor technologies. With an impressive portfolio of 59 patents, Khan's work has significantly contributed to enhancing the performance and efficiency of integrated circuit (IC) packaging techniques.
Latest Patents
Among his latest innovations, Khan has developed a "Thin recon interposer package without TSV for fine input/output pitch fan-out." This technology offers a dense interface between the active semiconductor die and the substrate. His circuit assembly includes features such as a silicon pad layer with multiple metal pads for bump connection, an oxide layer, and an interposer dielectric layer with routing traces. This method improves structural support for the IC die while facilitating high-density routing.
Another groundbreaking invention is the "High density redistribution layer (RDL) interconnect bridge using a reconstituted wafer." This IC package showcases high-density interconnects to connect multiple semiconductor dies, enhancing manufacturing yield and significantly reducing costs. The design employs a first dielectric layer with vias for input/output pads, along with interconnection layers enabling efficient communication between dies.
Career Highlights
Rezaur Rahman Khan has made substantial contributions during his tenure at prominent companies, including Broadcom Corporation and Avago Technologies General IP (Singapore) Pte. Ltd. His work in these organizations has placed him at the forefront of semiconductor innovation, helping to raise industry standards and improve devices' functionalities.
Collaborations
Throughout his career, Khan has collaborated with notable professionals such as Sam Ziqun Zhao and Pieter Vorenkamp. These collaborations have led to the development of several patents that address complex challenges in semiconductor manufacturing and design, further enhancing the capabilities of electronic devices.
Conclusion
Rezaur Rahman Khan's innovative contributions to the semiconductor field have established him as a leading figure in the industry. His extensive patent portfolio reflects his dedication to advancing technology and pushing the boundaries of what's possible in integrated circuit design. With ongoing advancements, the impact of his inventions will continue to resonate in the world of electronics for years to come.