The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 22, 2016
Filed:
Feb. 07, 2014
Broadcom Corporation, Irvine, CA (US);
Kevin Kunzhong Hu, Irvine, CA (US);
Sam Ziqun Zhao, Irvine, CA (US);
Rezaur Rahman Khan, Rancho Santa Margarita, CA (US);
Pieter Vorenkamp, Laguna Niguel, CA (US);
Sampath K. V. Karikalan, Irvine, CA (US);
Xiangdong Chen, Irvine, CA (US);
Broadcom Corporation, Irvine, CA (US);
Abstract
An exemplary implementation of the present disclosure includes a stacked package having a top die from a top reconstituted wafer situated over a bottom die from a bottom reconstituted wafer. The top die and the bottom die are insulated from one another by an insulation arrangement. The top die and the bottom die are also interconnected through the insulation arrangement. The insulation arrangement can include a top molding compound that flanks the top die and a bottom molding compound that flanks the bottom die. The top die and the bottom die can be interconnected through at least the top molding compound. Furthermore, the top die and the bottom die can be interconnected through a conductive via that extends within the insulation arrangement.