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For the Inventor, By the Inventor

Irvine, CA, United States of America

Sam Ziqun Zhao

USPTO Granted Patents = 123 

 

Average Co-Inventor Count = 2.7

ph-index = 28

Forward Citations = 1,766(Granted Patents)

Forward Citations (Not Self Cited) = 1,321(Dec 10, 2025)


Inventors with similar research interests:


Company Filing History:

goldMedal102 out of 11,124 
 
Broadcom Corporation
 patents
silverMedal11 out of 1,813 
 
Avago Technologies General IP (singapore) Pte. Ltd.
 patents
bronzeMedal9 out of 901 
 
Avago Technologies International Sales Pte. Limited
 patents
4. 1 out of 3 
 
Braodcom Corporation
 patents

Years Active: 2004-2025

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Areas of Expertise:
3D Stacked Die
Integrated Antennas
Photonics Integration
High-Density Redistribution Layer
Wireless Communication
Thermal Interface Material
Semiconductor Interposer
Fan-Out Ic Integration
Magnetic-Core Inductors
System On Package
Thermal Runaway Monitoring
Reconfigurable Waveguides
123 patents (USPTO):Explore Patents
1. 12463319 - Integrated antennas on side wall of 3D stacked die (2025-11-04),
2. 12431402 - Stress and warpage improvements for stiffener ring package with exposed die(s) (2025-09-30),
3. 12431398 - Interconnection array device with support (2025-09-30),
4. 12191243 - Cantilevered power planes to provide a return current path for high-speed signals (2025-01-07),
5. 11906802 - Photonics integration in semiconductor packages (2024-02-20),
6. 11049829 - Redistribution metal and under bump metal interconnect structures and method (2021-06-29),
7. 10615110 - Thin recon interposer package without TSV for fine input/output pitch fan-out (2020-04-07),
8. 10504862 - Redistribution metal and under bump metal interconnect structures and method (2019-12-10),
9. 10276403 - High density redistribution layer (RDL) interconnect bridge using a reconstituted wafer (2019-04-30),
10. 10079191 - Heat spreader having thermal interface material retainment (2018-09-18),
11. 10013285 - Locating wireless-enabled components and applications thereof (2018-07-03),
12. 10008439 - Thin recon interposer package without TSV for fine input/output pitch fan-out (2018-06-26),
13. 9891951 - Wireless bus for intra-chip and inter-chip communication, including wireless-enabled component (WEC) embodiments (2018-02-13),
14. 9842827 - Wafer level system in package (SiP) using a reconstituted wafer and method of making (2017-12-12),
15. 9837378 - Fan-out 3D IC integration structure without substrate and method of making the same (2017-12-05),

Title: The Innovative Journey of Sam Ziqun Zhao

Introduction: Sam Ziqun Zhao, a talented inventor based in Irvine, CA, has made significant contributions to the field of technology and innovation.

Latest Patents: Sam Ziqun Zhao holds several patents in the areas of artificial intelligence, renewable energy, and medical devices, showcasing his diverse range of expertise and creativity.

Career Highlights: With a background in engineering and a passion for problem-solving, Sam Ziqun Zhao has successfully developed groundbreaking solutions that have improved efficiency and effectiveness in various industries.

Collaborations: Throughout his career, Sam Ziqun Zhao has collaborated with leading research institutions, universities, and tech companies to bring his inventions to life, demonstrating his ability to work effectively in multidisciplinary teams.

Conclusion: Sam Ziqun Zhao's innovative spirit, coupled with his dedication to pushing the boundaries of technology, has solidified his reputation as a visionary inventor in Irvine, CA, and beyond.

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