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For the Inventor, By the Inventor

Irvine, CA, United States of America

Sam Ziqun Zhao

This inventor holds 128 USPTO granted patents and 41 published patent applications and 14 EPO patents, primarily in Semiconductor Packaging (CPC class H01L2224-16225). Top assignees: Broadcom Corporation, Avago Technologies International Sales Pte. Limited, Avago Technologies General IP (Singapore) Pte. Ltd.. Active years: 2004-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Sam Ziqun Zhao. Retrieved from https://idiyas.com/inventor/sam-ziqun-zhao

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 128 

% Patents Active = 74.2

 

Average Co-Inventor Count = 2.7

ph-index = 28

Forward Citations = 1,798(Granted Patents)

Forward Citations (Not Self Cited) = 1,321(Dec 10, 2025)


Inventors with similar research interests:

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Company Filing History:

goldMedal102 out of 11,124 
 
Broadcom Corporation
 patents
silverMedal14 out of 1,030 
 
Avago Technologies International Sales Pte. Limited
 patents
bronzeMedal11 out of 1,813 
 
Avago Technologies General IP (Singapore) Pte. Ltd.
 patents
4. 1 out of 3 
 
Braodcom Corporation
 patents

Years Active: 2004-2026

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Areas of Expertise:
Semiconductor Package
Interconnect Structures
Wireless Communication
Thermal Management
3D Stacked Die
Signal Integrity
Heat Spreader
Integrated Antennas
Redistribution Layer
Thermal Interface Material
Intra-chip Communication
Magnetic-core Inductors
128 patents (USPTO):Explore Patents
1. 12765357 - Semiconductor device backside power distribution network structure and method of making (2026-10-13),
2. 12713958 - PACKAGING SYSTEMS AND METHODS FOR SEMICONDUCTOR DEVICES (2026-08-18),
3. 12713917 - Microfluidic Channels for Cooling Hybrid Bonded Interfaces (2026-08-18),
4. 12593726 - Semiconductor package with side wall interconnection (2026-03-31),
5. 12525495 - Mixed dielectric materials for improving signal integrity of integrated electronics packages (2026-01-13),
6. 12463319 - Integrated antennas on side wall of 3D stacked die (2025-11-04),
7. 12431402 - Stress and warpage improvements for stiffener ring package with exposed die(s) (2025-09-30),
8. 12431398 - Interconnection array device with support (2025-09-30),
9. 12191243 - Cantilevered power planes to provide a return current path for high-speed signals (2025-01-07),
10. 11906802 - Photonics integration in semiconductor packages (2024-02-20),
11. 11049829 - Redistribution metal and under bump metal interconnect structures and method (2021-06-29),
12. 10615110 - Thin recon interposer package without TSV for fine input/output pitch fan-out (2020-04-07),
13. 10504862 - Redistribution metal and under bump metal interconnect structures and method (2019-12-10),
14. 10276403 - High density redistribution layer (RDL) interconnect bridge using a reconstituted wafer (2019-04-30),
15. 10079191 - Heat spreader having thermal interface material retainment (2018-09-18),

Title: The Innovative Journey of Sam Ziqun Zhao

Introduction: Sam Ziqun Zhao, a talented inventor based in Irvine, CA, has made significant contributions to the field of technology and innovation.

Latest Patents: Sam Ziqun Zhao holds several patents in the areas of artificial intelligence, renewable energy, and medical devices, showcasing his diverse range of expertise and creativity.

Career Highlights: With a background in engineering and a passion for problem-solving, Sam Ziqun Zhao has successfully developed groundbreaking solutions that have improved efficiency and effectiveness in various industries.

Collaborations: Throughout his career, Sam Ziqun Zhao has collaborated with leading research institutions, universities, and tech companies to bring his inventions to life, demonstrating his ability to work effectively in multidisciplinary teams.

Conclusion: Sam Ziqun Zhao's innovative spirit, coupled with his dedication to pushing the boundaries of technology, has solidified his reputation as a visionary inventor in Irvine, CA, and beyond.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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