The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 2025
Filed:
Jul. 26, 2022
Avago Technologies International Sales Pte. Limited, Singapore, SG;
Sam Ziqun Zhao, Irvine, CA (US);
Avago Technologies International Sales Pte. Limited, Singapore, SG;
Abstract
A package, and method for building the package is disclosed. The package includes a substrate having a first surface. The package further includes a die having opposing first and second surfaces, and a lateral surface, with the second surface of the die coupled to the first surface of the substrate. The package further includes a stiffener element having a first surface and a lateral surface, with the first surface of the stiffener element coupled to the first surface of the substrate. The package further includes molding material disposed on the first surface of the substrate and the lateral surface of the die. The coefficient of thermal expansion (CTE) value of the molding material is greater than a CTE value of the die. The first molding surface of the molding material is coplanar with the first surface of the die.