The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2026
Filed:
Apr. 06, 2023
Applicant:
Avago Technologies International Sales Pte. Limited, Singapore, SG;
Inventors:
Sam Ziqun Zhao, Irvine, CA (US);
Arun Ramakrishnan, Lake Forest, CA (US);
Teong Swee Tan, Penang, MY;
Assignee:
AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED, SINGAPORE, SG;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
U.S. Cl.
CPC ...
H10W 76/40 ; H10W 74/127 ; H10W 72/30 ; H10W 74/019 ; H10W 90/701 ; H10W 40/00 ; H10W 74/15 ; H10W 72/073 ; H10W 70/65 ; H10W 74/012 ; H10W 72/20 ; H10W 72/01308 ; H10W 90/724 ; H10W 72/347 ; H10W 40/258 ; H10W 72/07354 ; H10W 40/22 ; H10W 90/734 ; H10W 42/121 ; H10W 90/736 ; H10W 72/387 ;
Zhao, Sam. (2026). Packaging systems and methods for semiconductor devices (U.S. Patent No. 12713958). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12713958
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile