Irvine, CA, United States of America

Arun Ramakrishnan

This inventor holds 11 USPTO granted patents and 10 published patent applications. Top assignees: Avago Technologies International Sales Pte. Limited, Broadcom Corporation, Avago Technologies General IP (Singapore) Pte. Ltd.. Active years: 2015-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Arun Ramakrishnan. Retrieved from https://idiyas.com/inventor/arun-ramakrishnan-6c0bq8gu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 11 

% Patents Active = 100.0

Average Co-Inventor Count = 3.1

ph-index = 1

Forward Citations = 1(Granted Patents)


Location History:

  • Irvine, CA (US) (2015 - 2021)
  • Lake Forest, CA (US) (2024)

Company Filing History:


Years Active: 2015-2026

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11 patents (USPTO):Explore Patents

Title: Innovations of Arun Ramakrishnan

Introduction

Arun Ramakrishnan is a notable inventor based in Irvine, California, recognized for his contributions to semiconductor technology. With a total of six patents to his name, he has made significant advancements in the field, particularly in high-speed signal processing and photonics integration.

Latest Patents

One of his latest patents is titled "Cantilevered power planes to provide a return current path for high-speed signals." This invention presents novel tools and techniques for implementing cantilevered power planes that facilitate a return current path for high-speed signals. The semiconductor package described in this patent includes a substrate core and multiple layers, including power, ground, and signal layers. Each signal layer is strategically placed between a power layer and a ground layer, ensuring effective return paths for high-frequency signals. Additionally, the patent outlines the use of AC couplers that connect to power and ground layers without anchoring any portion of the power layer near the substrate core's edge.

Another significant patent by Arun is focused on "Photonics integration in semiconductor packages." This apparatus features a substrate with routing layers and an optical module that includes both a photonic integrated circuit (PIC) and an electronic integrated circuit (EIC). The PIC is partially embedded within the substrate, and the apparatus is designed to transmit or receive optical signals via a fiber optic coupler.

Career Highlights

Arun has worked with prominent companies in the technology sector, including Avago Technologies and Broadcom Corporation. His experience in these organizations has contributed to his expertise in semiconductor innovations and has allowed him to collaborate with leading professionals in the field.

Collaborations

Throughout his career, Arun has worked alongside talented individuals such as Dharmendra Saraswat and Reza Sharifi. These collaborations have further enriched his work and have led to the development of groundbreaking technologies.

Conclusion

Arun Ramakrishnan's contributions to the field of semiconductor technology through his innovative patents highlight his role as a leading inventor. His work continues to influence advancements in high-speed signal processing and photonics integration, showcasing the importance of innovation in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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