The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 06, 2021

Filed:

Jan. 17, 2019
Applicant:

Avago Technologies International Sales Pte. Limited, Singapore, SG;

Inventors:

Arun Ramakrishnan, Irvine, CA (US);

Reza Sharifi, Irvine, CA (US);

Dharmendra Saraswat, Irvine, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5286 (2013.01); H01L 24/25 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15311 (2013.01);
Abstract

Hexagonally arranged connection patterns for device packaging allow high density circuitry dies to be assembled into packages of manufacturable size. The connection patterns may be patterns for solder ball arrays or other types of connection mechanisms under a semiconductor package. Despite the increased density of the connection patterns, the connection patterns meet the demanding crosstalk specifications for high speed operation of the high density circuitry.


Find Patent Forward Citations

Ramakrishnan, Arun. (2021). Hexagonally arranged connection patterns for high-density device packaging (U.S. Patent No. 10971450). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10971450

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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