IDiyas

For the Inventor, By the Inventor

Irvine, CA, United States of America

Sampath K V Karikalan

USPTO Granted Patents = 13

Average Co-Inventor Count = 4.6

ph-index = 5

Forward Citations = 92(Granted Patents)


Company Filing History:

goldMedal13 out of 11,124 
 
Broadcom Corporation
 patents

Years Active: 2014-2017

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13 patents (USPTO):
1. 9548251 - Semiconductor interposer having a cavity for intra-interposer die (2017-01-17),
2. 9349697 - Microbump and sacrificial pad pattern (2016-05-24),
3. 9293393 - Stacked packaging using reconstituted wafers (2016-03-22),
4. 9275976 - System-in-package with integrated socket (2016-03-01),
5. 9153507 - Semiconductor package with improved testability (2015-10-06),
6. 9059179 - Semiconductor package with a bridge interposer (2015-06-16),
7. 9041171 - Programmable interposer with conductive particles (2015-05-26),
8. 9013041 - Semiconductor package with ultra-thin interposer without through-semiconductor vias (2015-04-21),
9. 8928128 - Semiconductor package with integrated electromagnetic shielding (2015-01-06),
10. 8907488 - Microbump and sacrificial pad pattern (2014-12-09),
11. 8872321 - Semiconductor packages with integrated heat spreaders (2014-10-28),
12. 8791533 - Semiconductor package having an interposer configured for magnetic signaling (2014-07-29),
13. 8749072 - Semiconductor package with integrated selectively conductive film interposer (2014-06-10),

Title: Innovations of Sampath K V Karikalan

Introduction

Sampath K V Karikalan is a prominent inventor based in Irvine, CA, known for his significant contributions to the field of semiconductor technology. With a total of 13 patents to his name, he has made remarkable advancements that have influenced the industry.

Latest Patents

One of his latest patents is for a semiconductor interposer having a cavity for intra-interposer die. This innovative semiconductor package includes a substrate and a semiconductor interposer with a cavity and multiple through semiconductor vias. The design allows for an intra-interposer die to be placed within the cavity, with a thermally conductive adhesive ensuring optimal contact. Additionally, a top die is positioned over the semiconductor interposer, enhancing the overall functionality. Another notable patent involves a microbump and sacrificial pad pattern for integrated circuit (IC) dies. This design features clusters of pads on the IC die's surface, each associated with specific circuits, allowing for efficient electrical coupling.

Career Highlights

Sampath K V Karikalan is currently employed at Broadcom Corporation, where he continues to innovate and develop cutting-edge technologies. His work has been instrumental in advancing semiconductor packaging and integrated circuit design.

Collaborations

Throughout his career, he has collaborated with notable colleagues, including Kevin Kunzhong Hu and Sam Ziqun Zhao, contributing to various projects that push the boundaries of semiconductor technology.

Conclusion

Sampath K V Karikalan's contributions to the semiconductor industry through his patents and collaborations highlight his role as a leading inventor. His innovative designs continue to shape the future of technology.

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