The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2015
Filed:
Feb. 27, 2012
Sampath K. V. Karikalan, Irvine, CA (US);
Kevin Kunzhong HU, Irvine, CA (US);
Sam Ziqun Zhao, Irvine, CA (US);
Rezaur Rahman Khan, Rancho Santa Margarita, CA (US);
Pieter Vorenkamp, Laguna Niguel, CA (US);
Xiangdong Chen, Irvine, CA (US);
Sampath K. V. Karikalan, Irvine, CA (US);
Kevin Kunzhong Hu, Irvine, CA (US);
Sam Ziqun Zhao, Irvine, CA (US);
Rezaur Rahman Khan, Rancho Santa Margarita, CA (US);
Pieter Vorenkamp, Laguna Niguel, CA (US);
Xiangdong Chen, Irvine, CA (US);
Broadcom Corporation, Irvine, CA (US);
Abstract
There are disclosed herein various implementations of a shield interposer situated between a top active die and a bottom active die for shielding the active dies from electromagnetic noise. One implementation includes an interposer dielectric layer, a through-silicon via (TSV) within the interposer dielectric layer, and an electromagnetic shield. The TSV connects the electromagnetic shield to a first fixed potential. The electromagnetic shield may include a grid of conductive layers laterally extending across the shield interposer. The shield interposer may also include another electromagnetic shield connected to another fixed potential.