The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 10, 2014
Filed:
Feb. 24, 2012
Sam Ziqun Zhao, Irvine, CA (US);
Kevin Kunzhong HU, Irvine, CA (US);
Sampath K. V. Karikalan, Irvine, CA (US);
Rezaur Rahman Khan, Rancho Santa Margarita, CA (US);
Pieter Vorenkamp, Laguna Niguel, CA (US);
Xiangdong Chen, Irvine, CA (US);
Sam Ziqun Zhao, Irvine, CA (US);
Kevin Kunzhong Hu, Irvine, CA (US);
Sampath K. V. Karikalan, Irvine, CA (US);
Rezaur Rahman Khan, Rancho Santa Margarita, CA (US);
Pieter Vorenkamp, Laguna Niguel, CA (US);
Xiangdong Chen, Irvine, CA (US);
Broadcom Corporation, Irvine, CA (US);
Abstract
There are disclosed herein various implementations of semiconductor packages having a selectively conductive film interposer. In one such implementation, a semiconductor package includes a first active die having a first plurality of electrical connectors on a top surface of the first active die, a selectively conductive film interposer situated over the first active die, and a second active die having a second plurality of electrical connectors on a bottom surface of the second active die. The selectively conductive film interposer may be configured to serve as an interposer and to selectively couple at least one of the first plurality of electrical connectors to at least one of the second plurality of electrical connectors.